Samsung electronics co., ltd. (20240266271). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240266271 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes a package substrate, an interposer with first upper pads, a first semiconductor chip with first lower pads connected to the first set of upper pads, and pins on the top surface of the chip spaced apart by different distances.
- The package includes a package substrate, an interposer, and a semiconductor chip with unique pad configurations.
- The first semiconductor chip has pins on its top surface spaced apart by different distances, creating distinct regions on the chip.
- The interposer connects the upper pads on the package substrate to the lower pads on the semiconductor chip.
- The innovative pin configuration on the semiconductor chip allows for efficient data transfer and electrical connections.
- This technology enhances the performance and reliability of semiconductor packages.
Potential Applications: - This technology can be applied in various electronic devices requiring high-speed data processing. - It can be used in telecommunications equipment, computer hardware, and consumer electronics.
Problems Solved: - Improved electrical connections between the package substrate and the semiconductor chip. - Enhanced data transfer efficiency and reliability in semiconductor packages.
Benefits: - Increased performance and reliability of electronic devices. - Enhanced data processing capabilities in various applications. - Improved overall efficiency of semiconductor packages.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be utilized in the development of high-performance electronic devices, leading to improved market competitiveness and customer satisfaction.
Questions about the technology: 1. How does the unique pin configuration on the semiconductor chip contribute to improved performance? 2. What are the potential cost-saving benefits of implementing this semiconductor packaging technology?
Original Abstract Submitted
a semiconductor package includes a package substrate, an interposer on the package substrate and including first upper pads, the first upper pads including a first set of upper pads and a second set of upper pads, a first semiconductor chip on the interposer and comprising first lower pads respectively connected to the first set of upper pads, a plurality of first pins on a first top surface of the first semiconductor chip and substantially uniformly spaced apart by a first distance, and a plurality of second pins on the first top surface of the first semiconductor chip and substantially uniformly spaced apart by a second distance that is different from the first distance, where the first top surface of the first semiconductor chip includes a first region and a second region that does not overlap the first region.
