Samsung electronics co., ltd. (20240250066). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Joonghyun Baek of Suwon-si (KR)
Cheol-Woo Lee of Suwon-si (KR)
Sunghwan Yoon of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240250066 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes first and second chip stacks, each containing semiconductor chips with an offset stack structure. The second chip stack is horizontally spaced apart from the first chip stack. Additionally, there are first and second buffer chips located on the substrate at the sides of the first and second chip stacks, respectively. A connection substrate is present on the first and second chip stacks, with a first mold layer covering the substrate, the first chip stack, and the second chip stack, exposing the top surface of the connection substrate. Furthermore, third and fourth chip stacks, each with semiconductor chips having an offset stack structure, are located on the first mold layer, with the fourth chip stack horizontally spaced apart from the third chip stack. A second mold layer covers the first mold layer, the third chip stack, and the fourth chip stack.
- The semiconductor package features chip stacks with offset stack structures, providing efficient use of space.
- Buffer chips on the substrate help in managing connections and data flow between the chip stacks.
- The connection substrate facilitates communication between the various chip stacks.
- The mold layers protect the components while allowing access to the connection substrate.
- The horizontal spacing between chip stacks optimizes the layout for enhanced performance.
Potential Applications: - This semiconductor package design could be utilized in various electronic devices requiring compact and efficient semiconductor chip arrangements.
Problems Solved: - Efficient use of space in semiconductor packages. - Improved communication and data flow management between chip stacks.
Benefits: - Enhanced performance due to optimized layout. - Space-saving design for compact electronic devices.
Commercial Applications: - This technology could be beneficial for manufacturers of smartphones, tablets, and other portable electronic devices looking to optimize space and performance in their products.
Questions about the Semiconductor Package Design: 1. How does the offset stack structure in the chip stacks contribute to the efficiency of the semiconductor package? 2. What are the potential challenges in implementing this semiconductor package design in mass production?
Original Abstract Submitted
a semiconductor package including first and second chip stacks each including semiconductor chips having an offset stack structure, the second chip stack horizontally spaced apart from the first chip stack, a first buffer chip on the substrate and at a side of the first chip stack, a second buffer chip on the substrate and at a side of the second chip stack, a connection substrate on the first and second chip stacks, a first mold layer covering the substrate, the first chip stack, and the second stack and exposing a top surface of the connection substrate, third and fourth chip stacks each including semiconductor chips having an offset stack structure on the first mold layer and, the fourth chip stack horizontally spaced apart from the third chip stack, and a second mold layer covering the first mold layer, the third chip stack, and the fourth chip stack may be provided.
