Samsung electronics co., ltd. (20240243153). IMAGE SENSOR simplified abstract
Contents
IMAGE SENSOR
Organization Name
Inventor(s)
IMAGE SENSOR - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240243153 titled 'IMAGE SENSOR
The abstract describes an image sensor comprising multiple semiconductor chips with various wiring structures and bonding pads.
- The image sensor includes a first semiconductor chip with a pixel unit and a first wiring structure.
- A second semiconductor chip is connected to the first chip, featuring a second wiring structure and bonding pads.
- A bonding layer with insulating properties is present on the second chip's surface, along with a lower bonding pad.
- A third semiconductor chip is connected to the second chip, with its own wiring structure and bonding pad.
Potential Applications: - This technology can be used in digital cameras, smartphones, and other devices requiring high-quality image sensors. - It can also be applied in medical imaging equipment, surveillance systems, and automotive cameras.
Problems Solved: - Enhances the performance and efficiency of image sensors by optimizing the connection between semiconductor chips. - Improves image quality and resolution in electronic devices that rely on image sensors.
Benefits: - Higher quality images with improved clarity and detail. - Increased reliability and durability of image sensor components. - Enhanced functionality and performance in various applications.
Commercial Applications: Title: Advanced Image Sensor Technology for Enhanced Visual Capture This technology can be utilized in the consumer electronics industry for the development of cutting-edge cameras and imaging devices. It can also benefit manufacturers of medical equipment, security systems, and automotive technology.
Prior Art: Readers interested in exploring prior art related to this technology can refer to patents and research papers in the field of semiconductor devices, image sensors, and semiconductor chip bonding techniques.
Frequently Updated Research: Researchers in the field of semiconductor technology are constantly working on improving image sensor performance, miniaturization, and integration with other electronic components. Stay updated on the latest advancements in this area to understand the full potential of this technology.
Questions about Image Sensor Technology: 1. How does this technology improve the overall image quality in electronic devices? - This technology enhances image quality by optimizing the connection between semiconductor chips, resulting in clearer and more detailed images. 2. What are the potential applications of this advanced image sensor technology? - This technology can be applied in various industries such as consumer electronics, medical imaging, surveillance, and automotive systems for improved visual capture.
Original Abstract Submitted
an image sensor is provided. the image sensor includes a first semiconductor chip including a first semiconductor substrate having a pixel unit, a first wiring structure having a first wiring layer, and a first bonding pad; a second semiconductor chip including a second semiconductor substrate having first and second surfaces, a second wiring structure on the first surface, contacting the first wiring structure, and having a second wiring layer, a second upper bonding pad bonded to the first bonding pad, and a via structure connected to the second wiring layer and extending to the second surface; a bonding layer including a bonding insulating layer on the second surface, and a second lower bonding pad connected to the via structure; and a third semiconductor chip including a third semiconductor substrate, a third wiring structure contacting the bonding insulating layer, and a third bonding pad bonded to the second lower bonding pad.
