Samsung electronics co., ltd. (20240243096). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Moonyong Jang of Suwon-si (KR)
Keunyoung Lee of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240243096 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes a first substrate with multiple wire layers stacked vertically, chip stack structures arranged in a first direction, a processor chip, and chip-to-chip wires connecting the closest chip stack structure to the processor chip.
- The semiconductor package features offset-stacked semiconductor chips within each chip stack structure.
- The chip stack structures are connected by wires to facilitate communication between the semiconductor chips.
- The design allows for efficient stacking of multiple semiconductor chips in a compact space.
- The chip-to-chip wires enable data transfer between the processor chip and the other semiconductor chips in the package.
- This innovative packaging design enhances the performance and functionality of the semiconductor package.
Potential Applications: - High-performance computing systems - Data centers - Artificial intelligence applications - Internet of Things (IoT) devices - Mobile devices
Problems Solved: - Increased data processing speed and efficiency - Enhanced communication between semiconductor chips - Compact and space-saving design for semiconductor packages
Benefits: - Improved overall performance of electronic devices - Enhanced data processing capabilities - Compact and efficient design for semiconductor packaging - Facilitates communication between semiconductor chips
Commercial Applications: Title: Advanced Semiconductor Packaging for High-Performance Computing This technology can be utilized in various commercial applications such as high-performance computing systems, data centers, AI applications, IoT devices, and mobile devices. The compact and efficient design of the semiconductor package enhances the performance and functionality of electronic devices.
Questions about Semiconductor Package with Chip Stack Structures: 1. How does the offset-stacked design of semiconductor chips within each chip stack structure improve performance? 2. What are the potential applications of this innovative semiconductor packaging technology in the electronics industry?
Original Abstract Submitted
embodiments of the present disclosure include a semiconductor package comprising a first substrate including a plurality of wires stacked in a plurality of layers in a vertical direction, a plurality of chip stack structures spaced apart from each other on the first substrate and arranged in a first direction, a processor chip disposed on the first substrate, and a chip-to-chip wire connecting a chip stack structure that is disposed closest to the processor chip among the plurality of chip stack structures, wherein each of the plurality of chip stack structures includes a plurality of semiconductor chips offset-stacked in the first direction and a plurality of wires connecting the plurality of semiconductor chips to one another.
