Samsung electronics co., ltd. (20240243053). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
KYOUNG LIM Suk of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240243053 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes multiple layers and structures to facilitate connections between semiconductor chips. The key components are:
- First redistribution layer
- First semiconductor chip
- Second semiconductor chip
- Second redistribution layer
- First connection structure
- Connection post
- Connection interconnection layer
These components work together to enable electrical connections between the semiconductor chips through a wire that connects the second redistribution layer and the first redistribution layer.
Potential Applications: - Advanced electronic devices - High-performance computing systems - Communication equipment
Problems Solved: - Facilitates complex interconnections in semiconductor packages - Enhances the efficiency of electronic devices
Benefits: - Improved performance of electronic systems - Enhanced reliability of connections - Compact design for space-saving applications
Commercial Applications: Title: "Advanced Semiconductor Packaging for High-Performance Electronics" This technology can be used in various industries such as telecommunications, consumer electronics, and automotive for high-speed data processing and efficient communication systems.
Questions about the technology: 1. How does the connection post improve the electrical connections between semiconductor chips? 2. What are the advantages of having multiple redistribution layers in a semiconductor package?
Frequently Updated Research: Researchers are continually exploring new materials and designs to further enhance the performance and reliability of semiconductor packages. Stay updated on the latest advancements in this field for potential breakthroughs in electronic systems.
Original Abstract Submitted
a semiconductor package includes a first redistribution layer; a first semiconductor chip above the first redistribution layer; a second semiconductor chip above the first semiconductor chip; a second redistribution layer above the second semiconductor chip; a first connection structure on the second redistribution layer; a connection post on the first connection structure; and a connection interconnection layer on the connection post, wherein the connection interconnection layer comprises a connection insulating layer and a connection via extending through the connection insulating layer, and wherein the second redistribution layer and the first redistribution layer are electrically connected to each other through a wire.
