Samsung electronics co., ltd. (20240234388). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Heejung Hwang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240234388 titled 'SEMICONDUCTOR PACKAGE
The patent application describes a package structure with multiple semiconductor chips, encapsulants, and through-vias.
- The first package structure includes a redistribution structure, at least one semiconductor chip, an encapsulant, and a through-via.
- The second package structure is placed on top of the first package structure and includes similar components.
- The through-vias pass through the encapsulants of both package structures.
- The upper ends of the through-vias are positioned between non-active surfaces.
Potential Applications: - This technology can be used in the manufacturing of advanced electronic devices. - It can be applied in the development of high-performance integrated circuits.
Problems Solved: - Provides a compact and efficient packaging solution for multiple semiconductor chips. - Ensures proper connectivity and protection for the chips.
Benefits: - Improved performance and reliability of electronic devices. - Enhanced thermal management capabilities.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Device Performance This technology can be utilized in the production of smartphones, tablets, and other consumer electronics. It can also be beneficial in the automotive industry for advanced driver assistance systems.
Prior Art: Readers can explore existing patents related to semiconductor packaging technologies and through-via structures to understand the background of this innovation.
Frequently Updated Research: Researchers are constantly working on improving semiconductor packaging techniques to enhance the functionality and efficiency of electronic devices.
Questions about the technology: 1. How does this packaging technology compare to traditional methods? - This technology offers a more compact and efficient solution compared to traditional packaging methods by allowing multiple semiconductor chips to be stacked and interconnected effectively. 2. What are the potential challenges in implementing this advanced packaging technology? - Some challenges may include optimizing the manufacturing process to ensure high yields and reliability in mass production.
Original Abstract Submitted
a first package structure including a first redistribution structure, at least one first semiconductor chip disposed on the first redistribution structure, a first encapsulant covering the at least one first semiconductor chip, and a first through-via passing through the first encapsulant; a second package structure including a second redistribution structure, at least one second semiconductor chip disposed on the second redistribution structure, a second encapsulant covering the at least one second semiconductor chip, and a second through-via passing through the second encapsulant. the second package structure is disposed on the first package structure. at least one of a first upper end of the first through-via or a second upper end of the second through-via is between a first non-active surface and a second non-active surface.
