Samsung electronics co., ltd. (20240234376). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Hyun Soo Chung of Suwon-si (KR)
Young Lyong Kim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240234376 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a circuit board, an interposer structure, a mold layer, and two semiconductor chips positioned on the interposer structure and electrically connected to it. The mold layer wraps around the chips and includes a penetrating portion in the trenches of the interposer structure.
- The semiconductor package includes a circuit board, an interposer structure, a mold layer, and two semiconductor chips.
- The interposer structure has trenches in the edge region and the mold layer wraps around the chips.
- The mold layer has a penetrating portion in the trenches and a stack portion on the interposer structure.
- The bottom surface of the penetrating portion of the mold layer aligns with the bottom surface of the interposer structure.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor packages for various electronic devices. - It can improve the performance and reliability of integrated circuits in applications such as smartphones, computers, and automotive electronics.
Problems Solved: - Enhances the thermal management and electrical connectivity of semiconductor chips in a compact package. - Provides a protective barrier for the chips against external elements and mechanical stress.
Benefits: - Increased efficiency and durability of semiconductor devices. - Enables higher levels of integration in electronic systems. - Enhances overall performance and longevity of electronic products.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be utilized in the production of high-performance electronic devices, leading to improved functionality and reliability. It has significant implications for the semiconductor industry, particularly in the development of cutting-edge electronic products.
Questions about Semiconductor Packaging Technology: 1. How does this semiconductor packaging technology improve the performance of electronic devices? 2. What are the key advantages of using an interposer structure in semiconductor packaging?
Frequently Updated Research: Researchers are constantly exploring new materials and manufacturing techniques to further enhance the efficiency and reliability of semiconductor packaging technology. Stay updated on the latest advancements in this field to leverage the full potential of this innovation.
Original Abstract Submitted
a semiconductor package may include a circuit board, an interposer structure on the circuit board, a mold layer, and a first semiconductor chip and a second semiconductor chip spaced apart from each other in a first direction on a center region of the interposer structure and electrically connected to the interposer structure. the interposer structure may include a plurality of trenches in an edge region of the interposer structure and extending through the interposer structure. the mold layer may be in the plurality of trenches and may wrap the first and second semiconductor chips. the mold layer may include a penetrating portion in the plurality of trenches and a stack portion on the interposer structure. a bottom surface of the penetrating portion of the mold layer may be on a same plane as a bottom surface of the interposer structure.
