Samsung electronics co., ltd. (20240234325). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
JOONGHYUN Baek of Suwon-si (KR)
HYUNSOO Chung of Suwon-si (KR)
SEOK-HONG Kwon of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240234325 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a first redistribution layer, a first semiconductor chip, and a second semiconductor chip. The first redistribution layer includes a first intervening interconnection layer and a first upper interconnection layer. The first intervening interconnection layer comprises a first intervening insulating layer, a first intervening redistribution pattern, and a stress buffer pattern that is electrically floated and spaced apart from the first intervening redistribution pattern. The first upper interconnection layer includes a first upper insulating layer, a first upper redistribution pattern, and a first test pad on the first upper redistribution pattern. The stress buffer pattern has a larger area than the first test pad.
- The semiconductor package includes a unique stress buffer pattern that is electrically floated and larger in area than the test pad.
- The design allows for better stress distribution and management within the package.
- The use of multiple semiconductor chips in the package enhances overall performance and functionality.
- The specific layout of the redistribution layers optimizes electrical connections and signal transmission.
- The package design offers improved reliability and durability in various applications.
Potential Applications: - This technology can be applied in the manufacturing of advanced electronic devices such as smartphones, tablets, and computers. - It can also be used in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Improved stress distribution and management within semiconductor packages. - Enhanced reliability and durability of electronic devices. - Optimization of electrical connections for better performance.
Benefits: - Increased performance and functionality of electronic devices. - Enhanced reliability and durability. - Improved signal transmission and electrical connections.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be utilized in the production of high-performance electronic devices across various industries, leading to improved product quality and reliability. The market implications include increased demand for advanced semiconductor packaging solutions in the consumer electronics, automotive, medical, and industrial sectors.
Questions about Semiconductor Packaging Technology: 1. How does the stress buffer pattern in the semiconductor package contribute to improved performance and reliability? The stress buffer pattern helps in better stress distribution within the package, leading to enhanced reliability and durability of electronic devices.
2. What are the potential applications of this semiconductor packaging technology beyond consumer electronics? This technology can also be beneficial in automotive electronics, medical devices, and industrial equipment, where reliability and performance are crucial factors.
Original Abstract Submitted
a semiconductor package includes a first redistribution layer, a first semiconductor chip, and a second semiconductor chip. the first redistribution layer includes a first intervening interconnection layer and a first upper interconnection layer. the first intervening interconnection layer includes a first intervening insulating layer, a first intervening redistribution pattern, and a stress buffer pattern, which is spaced apart from the first intervening redistribution pattern and is in an electrically floated state. the first upper interconnection layer includes a first upper insulating layer, a first upper redistribution pattern, and a first test pad on the first upper redistribution pattern. an area of the stress buffer pattern is larger than an area of the first test pad.
