Samsung electronics co., ltd. (20240234253). SEMICONDUCTOR DEVICE simplified abstract

SEMICONDUCTOR DEVICE

Organization Name

samsung electronics co., ltd.

Inventor(s)

Wookyung You of Suwon-si (KR)

Yeonggil Kim of Suwon-si (KR)

Sangkoo Kang of Suwon-si (KR)

Minjae Kang of Suwon-si (KR)

Koungmin Ryu of Suwon-si (KR)

Hoonseok Seo of Suwon-si (KR)

Woojin Lee of Suwon-si (KR)

SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240234253 titled 'SEMICONDUCTOR DEVICE

The semiconductor device described in the abstract includes a device structure with a first semiconductor substrate and an active pattern extending in a first direction. It also features a conductive through-via that is electrically connected to a front wiring layer and penetrates through the first semiconductor substrate. The first semiconductor substrate has a non-planarized lower surface with a curved peripheral region around the conductive through-via, while a first bonding structure includes a planarized insulating layer on the second surface of the first semiconductor substrate with a planarized upper surface.

• The device structure includes a first semiconductor substrate and an active pattern.
• A conductive through-via is electrically connected to a front wiring layer.
• The through-via penetrates through the first semiconductor substrate.
• The first semiconductor substrate has a non-planarized lower surface with a curved peripheral region.
• A first bonding structure features a planarized insulating layer and a planarized upper surface.

Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor devices. - It can improve the performance and reliability of electronic components. - The design allows for more efficient heat dissipation in semiconductor devices.

Problems Solved: - Non-planarized surfaces in semiconductor devices can lead to manufacturing challenges. - Curved peripheral regions can affect the overall performance and reliability of the device. - Ensuring proper electrical connections through the substrate is crucial for device functionality.

Benefits: - Improved manufacturing processes for semiconductor devices. - Enhanced performance and reliability of electronic components. - Better heat dissipation capabilities in semiconductor devices.

Commercial Applications: Title: Advanced Semiconductor Device Technology for Enhanced Performance This technology can be utilized in the production of high-performance electronic devices, such as smartphones, computers, and automotive electronics. The improved design and structure offer increased efficiency and reliability, making it a valuable innovation for the semiconductor industry.

Questions about Semiconductor Device Technology: 1. How does the non-planarized lower surface of the semiconductor substrate impact device performance? The non-planarized lower surface, particularly the curved peripheral region, can affect the overall functionality and reliability of the device by creating challenges in manufacturing and electrical connections.

2. What are the advantages of using a conductive through-via in semiconductor devices? A conductive through-via allows for efficient electrical connections between different layers of the device, improving performance and reliability.

Original Abstract Submitted

a semiconductor device includes: a device structure including a first semiconductor substrate and having an active pattern extending in first direction, a conductive through-via electrically connected to a front wiring layer and penetrating through the first semiconductor substrate, wherein the first semiconductor substrate has a non-planarized lower surface in which a peripheral region around the conductive through-via curves downward, a first bonding structure having a planarized insulating layer disposed on the second surface of the first semiconductor substrate and having a planarized upper surface.