Samsung electronics co., ltd. (20240222241). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222241 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes a first substrate with solder balls on its lower surface and a first semiconductor chip on its upper surface. The arrangement of the solder balls is such that they are positioned at specific distances and directions from the center of the substrate.
- The first ball is located in a first direction from the center of the substrate, while the second ball is placed in a third direction between the first and second directions.
- The first pitch between the first ball and its adjacent ball on the outer side is less than the second pitch between the first ball and its adjacent ball on the inner side.
- The second ball is spaced apart from the center by a distance less than or equal to the distance of the first ball.
Potential Applications: - This technology can be used in various semiconductor packaging applications where precise positioning of solder balls is crucial. - It can enhance the performance and reliability of semiconductor devices by optimizing the electrical connections.
Problems Solved: - This innovation addresses the challenge of achieving optimal solder ball placement for improved functionality and connectivity in semiconductor packages.
Benefits: - Improved electrical connections and reliability in semiconductor devices. - Enhanced performance and efficiency of semiconductor packages.
Commercial Applications: - This technology has potential commercial applications in the semiconductor industry for manufacturing advanced electronic devices with superior performance and reliability.
Questions about the technology: 1. How does the specific arrangement of solder balls contribute to the overall performance of the semiconductor package? 2. What are the potential challenges in implementing this technology in mass production of semiconductor devices?
Original Abstract Submitted
a semiconductor package includes a first substrate. solder balls are disposed on a lower surface of the first substrate. a first semiconductor chip is on an upper surface of the first substrate. the solder balls include a first ball disposed in a first direction from a center of the first substrate and spaced apart from the center by a first distance. a second ball is disposed in a third direction from the center between the first and second directions and is spaced apart from the center by a second distance less than or equal to the first distance. a first pitch between the first ball and a first adjacent ball disposed immediately to an outer side in the first direction is less than a second pitch between the first ball and a second adjacent ball disposed immediately adjacent to an inner side in the first direction.
