Samsung electronics co., ltd. (20240194642). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Hyunggyun Noh of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240194642 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation: The semiconductor package described in the patent application consists of a lower chip with a chip stacked structure on top. This structure includes multiple upper chips with an underfill layer between them. A molding layer surrounds the underfill layer and the chip stacked structure. Both the lower chip and at least one of the upper chips have trenches on their upper surfaces.
- The semiconductor package includes a lower chip and a chip stacked structure.
- The chip stacked structure comprises multiple upper chips.
- An underfill layer is present between the lower chip and the upper chips.
- A molding layer surrounds the underfill layer and the chip stacked structure.
- Trenches are found on the upper surfaces of both the lower chip and at least one of the upper chips.
Key Features and Innovation:
- Stacked structure design for semiconductor packaging.
- Underfill layer for improved stability and protection.
- Trenches on upper surfaces for specific functionality.
Potential Applications: The technology can be applied in the semiconductor industry for advanced packaging solutions, particularly in high-density integrated circuits.
Problems Solved: The technology addresses the need for efficient and reliable semiconductor packaging methods for complex chip structures.
Benefits:
- Enhanced structural integrity.
- Improved thermal management.
- Increased functionality in a compact design.
Commercial Applications: The technology can be utilized in the production of high-performance electronic devices, such as smartphones, tablets, and computers, to improve overall performance and reliability.
Prior Art: Readers can explore prior research on semiconductor packaging methods, advanced chip stacking techniques, and underfill materials in the semiconductor industry.
Frequently Updated Research: Stay updated on the latest advancements in semiconductor packaging technologies, materials, and design methodologies to enhance product development and innovation.
Questions about Semiconductor Packaging: 1. What are the key advantages of using a chip stacked structure in semiconductor packaging? 2. How does the presence of trenches on the upper surfaces of chips impact the overall performance of the semiconductor package?
Original Abstract Submitted
a semiconductor package includes a lower chip. a chip stacked structure is arranged on the lower chip. the chip stacked structure includes a plurality of upper chips. an underfill layer is disposed between the lower chip and the chip stacked structure and between the plurality of upper chips. a molding layer surrounds the underfill layer and the chip stacked structure. the lower chip has at least one lower trench positioned on an upper surface of the lower chip. at least one of the plurality of upper chips has at least one upper trench on an upper surface of the at least one of the plurality of upper chips.
