Samsung electronics co., ltd. (20240186277). SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Unbyoung Kang of SUWON-SI (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240186277 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes multiple semiconductor chips facing each other, bumps on the front or rear surface of one of the chips, an underfill layer surrounding the bumps, and insulating frames on the front or rear surface of one of the chips, overlapping corner regions.
- Semiconductor package with multiple chips facing each other
- Bumps on the front or rear surface of one chip
- Underfill layer surrounding the bumps
- Insulating frames on the front or rear surface, overlapping corner regions
Potential Applications
The technology described in this patent application could be applied in:
- Advanced electronic devices
- High-performance computing systems
- Communication equipment
Problems Solved
This technology helps in:
- Enhancing the performance of semiconductor packages
- Improving thermal management
- Increasing reliability and durability of electronic devices
Benefits
The benefits of this technology include:
- Higher efficiency in electronic devices
- Better heat dissipation
- Longer lifespan of semiconductor packages
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Consumer electronics
- Automotive industry
- Aerospace sector
Possible Prior Art
One possible prior art for this technology could be:
- Existing semiconductor packaging techniques
- Previous methods of thermal management in electronic devices
Unanswered Questions
How does this technology compare to traditional semiconductor packaging methods?
This article does not provide a direct comparison between this technology and traditional semiconductor packaging methods.
What are the specific challenges faced in implementing this technology in mass production?
The article does not address the specific challenges faced in implementing this technology in mass production.
Original Abstract Submitted
a semiconductor package includes a plurality of semiconductor chips that face each other, a plurality of bumps disposed on a front surface or a rear surface of one of the plurality of semiconductor chips, an underfill layer that surrounds the plurality of bumps, and a plurality of insulating frames spaced apart from each other on the front or rear surface of one of the plurality of semiconductor chips. the plurality of insulating frames overlap a plurality of corner regions of the one of the plurality of semiconductor chips in a direction in which the plurality of semiconductor chips face each other.
