Samsung electronics co., ltd. (20240178185). SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
KYUNG DON Mun of Suwon-si (KR)
KYOUNG LIM Suk of Suwon-si (KR)
HYEONJEONG Hwang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178185 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes a lower circuit part with a connection structure and a logic chip in separate regions, a memory structure overlapping the connection structure vertically, and a thermal radiation structure overlapping the logic chip vertically. The logic chip and memory structure are spaced apart horizontally.
- Connection structure and logic chip in separate regions
- Memory structure overlaps connection structure vertically
- Thermal radiation structure overlaps logic chip vertically
- Logic chip and memory structure spaced apart horizontally
Potential Applications
The technology described in this semiconductor package could be applied in:
- High-performance computing systems
- Data centers
- Artificial intelligence applications
Problems Solved
This technology helps in:
- Improving thermal management in semiconductor packages
- Enhancing performance and reliability of logic chips and memory structures
- Optimizing space utilization in electronic devices
Benefits
The benefits of this technology include:
- Increased efficiency in heat dissipation
- Enhanced performance of logic chips and memory structures
- Compact design for electronic devices
Potential Commercial Applications
The semiconductor package innovation could be utilized in:
- Consumer electronics
- Automotive electronics
- Aerospace industry
Possible Prior Art
One possible prior art could be the use of heat sinks in semiconductor packages to manage thermal radiation and improve performance.
Unanswered Questions
How does this technology compare to existing solutions in terms of cost-effectiveness?
The abstract does not provide information on the cost-effectiveness of this technology compared to existing solutions. Further research or analysis would be needed to determine this aspect.
What impact does this technology have on power consumption in electronic devices?
The abstract does not address the impact of this technology on power consumption in electronic devices. Additional studies would be required to evaluate this aspect.
Original Abstract Submitted
disclosed is a semiconductor package comprising a lower circuit part having a first region and a second region horizontally offset from each other and including a connection structure within the first region and a logic chip within the second region, a memory structure that overlaps the connection structure in a vertical direction, and a thermal radiation structure that overlaps the logic chip in the vertical direction. the logic chip and the memory structure are spaced apart in a horizontal direction parallel to a top surface of the logic chip.
