Samsung display co., ltd. (20240322713). ELECTROSTATIC CHUCK AND THIN FILM DEPOSITION APPARATUS INCLUDING THE SAME simplified abstract
Contents
ELECTROSTATIC CHUCK AND THIN FILM DEPOSITION APPARATUS INCLUDING THE SAME
Organization Name
Inventor(s)
MINCHUL Song of Yongin-si (KR)
SANGHEON Jeon of Yongin-si (KR)
ELECTROSTATIC CHUCK AND THIN FILM DEPOSITION APPARATUS INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240322713 titled 'ELECTROSTATIC CHUCK AND THIN FILM DEPOSITION APPARATUS INCLUDING THE SAME
The thin film deposition apparatus described in the abstract includes a chamber, a deposition source, a mask assembly, and an electrostatic chuck.
- The chamber houses the components of the apparatus.
- The deposition source supplies a deposition material to the substrate.
- The mask assembly has pattern holes for the deposition material to pass through.
- The electrostatic chuck fixes the substrate in place during the deposition process.
Potential Applications:
- Semiconductor manufacturing
- Optoelectronics
- Microelectronics
Problems Solved:
- Precise deposition of thin films
- Uniform coating on substrates
- Enhanced control over deposition process
Benefits:
- Improved quality of thin film coatings
- Increased efficiency in manufacturing processes
- Enhanced performance of electronic devices
Commercial Applications:
- Production of solar cells
- Manufacturing of integrated circuits
- Development of display technologies
Questions about the Technology: 1. How does the electrostatic chuck contribute to the precision of thin film deposition? 2. What advantages does the mask assembly provide in the deposition process?
Frequently Updated Research: Research on advanced materials for thin film deposition Studies on the optimization of electrostatic chuck designs
Overall, the thin film deposition apparatus described in the patent application offers a sophisticated solution for precise and controlled deposition of thin films, with potential applications in various high-tech industries.
Original Abstract Submitted
a thin film deposition apparatus according to an embodiment includes a chamber, a deposition source disposed in a chamber and that supplies a deposition material to the substrate, a mask assembly comprising pattern holes through which the deposition material passes, and an electrostatic chuck facing the mask assembly and that fixes the substrate. the electrostatic chuck comprises a body that supports the substrate, an insulating layer disposed on the body, a first electrode disposed in the insulating layer and spaced apart from the body by a first distance, a second electrode disposed in the insulating layer and spaced apart from the body by a second distance, and a conductive layer disposed in the insulating layer and spaced apart from the body by a third distance. the first electrode and the second electrode are supplied with different voltages, and the third distance is greater than the first distance.
