Samsung display co., ltd. (20240200186). DEPOSITION APPARATUS simplified abstract
Contents
DEPOSITION APPARATUS
Organization Name
Inventor(s)
HYUNGYU Kang of Yongin-si (KR)
JONGWOOK Chae of Yongin-si (KR)
Gan Young Park of Yongin-si (KR)
DEPOSITION APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240200186 titled 'DEPOSITION APPARATUS
Simplified Explanation: The patent application describes a deposition apparatus with a chamber and a deposition source containing multiple nozzles that spray different materials. The deposition source also includes angle controlling structures around the nozzles.
- The deposition apparatus includes a chamber and a deposition source with multiple nozzles.
- Each nozzle sprays different materials, with some containing angle controlling structures.
- The apparatus allows for precise control over the deposition process.
Potential Applications: 1. Semiconductor manufacturing 2. Thin film deposition 3. Solar cell production
Problems Solved: 1. Lack of precision in material deposition 2. Inefficient use of deposition materials 3. Limited control over deposition angles
Benefits: 1. Improved accuracy in material deposition 2. Enhanced efficiency in material usage 3. Greater control over deposition angles
Commercial Applications: The technology could be utilized in industries such as semiconductor manufacturing, thin film deposition, and solar cell production to enhance the precision and efficiency of material deposition processes.
Questions about Deposition Apparatus: 1. How does the angle controlling structure impact the deposition process? 2. What are the potential cost savings associated with using this deposition apparatus?
Frequently Updated Research: Researchers are continually exploring new materials and methods to improve the efficiency and precision of deposition processes in various industries. Stay updated on the latest advancements in material deposition technology to ensure optimal performance in manufacturing processes.
Original Abstract Submitted
an embodiment provides a deposition apparatus including a chamber; and a deposition source disposed in the chamber and including a plurality of nozzles arranged in a first direction. each of the plurality of nozzles includes at least one first nozzle including a first nozzle hole spraying a first deposition material and a second nozzle hole spraying a second deposition material, and the deposition source further includes at least one angle controlling structure surrounding the at least one first nozzle.