Samsung display co., ltd. (20240175115). DEPOSITION MASK simplified abstract
Contents
DEPOSITION MASK
Organization Name
Inventor(s)
SEUNGPYO Hong of Yongin-si (KR)
DEPOSITION MASK - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240175115 titled 'DEPOSITION MASK
Simplified Explanation
The deposition mask described in the patent application includes three portions, with the third portion defining an opening corresponding to the desired pattern. The upper surface of the third portion is perpendicular to the thickness direction of the mask.
- The deposition mask has a first portion with an upper surface, a second portion half-etched to a first depth, and a third portion half-etched to a second depth, defining the pattern opening.
- The upper surface of the third portion is perpendicular to the thickness direction of the mask.
Potential Applications
The technology can be used in semiconductor manufacturing, photolithography processes, and microfabrication industries.
Problems Solved
The deposition mask simplifies the process of forming patterns on substrates, improving accuracy and efficiency in deposition processes.
Benefits
The mask allows for precise patterning on substrates, reducing material waste and increasing production yield. It also enables the creation of complex patterns with high resolution.
Potential Commercial Applications
"Deposition Mask for Pattern Formation in Semiconductor Manufacturing and Microfabrication"
Possible Prior Art
There may be prior art related to deposition masks used in photolithography processes and semiconductor manufacturing.
What is the cost of manufacturing the deposition mask described in the patent application?
The cost of manufacturing the deposition mask may vary depending on the materials used, the complexity of the design, and the manufacturing process. Factors such as the size of the mask, the etching techniques employed, and the quality control measures in place can all impact the overall cost.
How does the deposition mask compare to traditional patterning methods in terms of accuracy and efficiency?
The deposition mask offers improved accuracy and efficiency compared to traditional patterning methods. By defining the pattern opening with precision and ensuring perpendicularity to the thickness direction, the mask allows for more precise deposition processes, reducing material waste and increasing production yield.
Original Abstract Submitted
a deposition mask for forming a pattern on a substrate to be deposited, includes a first portion having an upper surface, a second portion having an upper surface half-etched to a first depth from the upper surface of the first portion, and a third portion having an upper surface half-etched to a second depth from the upper surface of the second portion. the third portion defines an opening corresponding to the pattern, and an upper surface of the third portion includes a plane perpendicular to a thickness direction of the deposition mask.
