Rohm co., ltd. (20240282749). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240282749 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the patent application includes a chip with a main surface, a main surface electrode covering the main surface, pillar electrodes arranged on the main surface electrode at intervals, a sealing insulator covering a region between the pillar electrodes on the main surface electrode to expose parts of the pillar electrodes, and at least one terminal film covering at least one of the pillar electrodes on the sealing insulator.
- Pillar electrodes arranged on the main surface electrode at intervals
- Sealing insulator covering a region between the pillar electrodes on the main surface electrode
- Exposed parts of the pillar electrodes
- Terminal film covering at least one of the pillar electrodes on the sealing insulator
Potential Applications: - Semiconductor manufacturing - Electronics industry - Integrated circuit design
Problems Solved: - Improved connectivity in semiconductor devices - Enhanced durability and reliability - Efficient use of space on the chip
Benefits: - Increased performance of semiconductor devices - Enhanced functionality - Cost-effective manufacturing process
Commercial Applications: Title: Advanced Semiconductor Devices for Enhanced Performance This technology can be utilized in the production of high-performance electronic devices, leading to improved efficiency and reliability in various industries such as telecommunications, consumer electronics, and automotive.
Prior Art: Readers can explore prior patents related to semiconductor device manufacturing processes, electrode design, and insulator materials to gain a deeper understanding of the technological advancements in the field.
Frequently Updated Research: Stay updated on the latest advancements in semiconductor device technology, electrode materials, and insulator innovations to remain at the forefront of industry developments.
Questions about Semiconductor Devices: 1. How does the design of pillar electrodes impact the performance of semiconductor devices? 2. What are the key considerations in selecting materials for the sealing insulator in semiconductor devices?
Original Abstract Submitted
a semiconductor device includes a chip that has a main surface, a main surface electrode that covers the main surface, pillar electrodes that are arranged on the main surface electrode at an interval, a sealing insulator that covers a region between the pillar electrodes on the main surface electrode such as to expose parts of the pillar electrodes, and at least one terminal film that covers at least one of the pillar electrodes on the sealing insulator.
