Rohm co., ltd. (20240282682). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240282682 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application includes a die pad, a semiconductor device with a chip, main surface electrode, terminal electrode, and sealing insulator, as well as a package body that seals the components.
- Die pad with semiconductor device and sealing insulator
- Semiconductor device with main surface electrode and terminal electrode
- Sealing insulator made of first matrix resin and fillers
- Package body with second matrix resin and fillers
- Sealing insulator covering terminal electrode to expose a part of it
Potential Applications: - Semiconductor industry for packaging and protecting semiconductor devices - Electronics manufacturing for integrated circuits and microchips
Problems Solved: - Protecting semiconductor devices from external elements - Ensuring proper functioning and longevity of semiconductor components
Benefits: - Enhanced durability and reliability of semiconductor packages - Improved performance of semiconductor devices - Cost-effective packaging solution for electronics industry
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Electronics Industry This technology can be used in various electronic devices such as smartphones, computers, and automotive electronics, enhancing their performance and longevity in the market.
Questions about Semiconductor Packaging Technology: 1. How does the sealing insulator protect the terminal electrode in the semiconductor package? The sealing insulator covers the periphery of the terminal electrode to shield it from external factors while exposing a part of it for connectivity. 2. What are the main components of the package body in the semiconductor package? The package body consists of a second matrix resin and fillers to seal the die pad and semiconductor device effectively.
Original Abstract Submitted
a semiconductor package includes a die pad, a semiconductor device that is arranged on the die pad, and that has a chip having a main surface, a main surface electrode arranged on the main surface, a terminal electrode arranged on the main surface electrode, and a sealing insulator including a first matrix resin and first fillers, and covering a periphery of the terminal electrode on the main surface such as to expose a part of the terminal electrode, and a package body that includes a second matrix resin and second fillers, and that seals the die pad and the semiconductor device such as to cover the sealing insulator.
