Rohm co., ltd. (20240282678). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Ryotaro Kakizaki of Kyoto-shi (JP)
Yasumasa Kasuya of Kyoto-shi (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240282678 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract includes a semiconductor element, a first lead with a die pad portion and a first terminal portion, and a sealing resin. The first lead is exposed from a resin surface and spaced apart from another resin surface in a specific direction. The first terminal portion consists of two portions, with only one passing through a resin surface. The first portion is spaced apart from a resin surface in a different direction, while the second portion is used for mounting on one side relative to the first portion.
- The semiconductor device features a unique lead design with specific spacing and orientation for optimal functionality.
- The inclusion of a sealing resin ensures the protection and longevity of the semiconductor element.
- The two-part terminal portion allows for efficient mounting and connection within the device.
- The design of the device aims to enhance performance and reliability in semiconductor applications.
- The innovative lead configuration sets this semiconductor device apart in the market.
Potential Applications: - This semiconductor device can be used in various electronic applications requiring reliable semiconductor components. - It is suitable for use in consumer electronics, automotive systems, industrial machinery, and more.
Problems Solved: - The device addresses the need for a well-designed lead structure for semiconductor elements. - It solves the challenge of efficient mounting and connection in semiconductor devices.
Benefits: - Improved performance and reliability in semiconductor applications. - Enhanced protection and longevity of semiconductor elements. - Efficient mounting and connection capabilities for ease of use.
Commercial Applications: Title: Innovative Semiconductor Device for Enhanced Performance in Electronic Applications This semiconductor device can be commercially utilized in the manufacturing of consumer electronics, automotive systems, industrial machinery, and other electronic devices. Its unique lead design and reliable performance make it a valuable component in various industries.
Questions about the Semiconductor Device: 1. How does the unique lead design of this semiconductor device contribute to its overall performance and functionality? 2. What specific advantages does the sealing resin provide in terms of protecting the semiconductor element and ensuring longevity?
Original Abstract Submitted
a semiconductor device includes: a semiconductor element; a first lead including a die pad portion and a first terminal portion; and a sealing resin. a first lead reverse surface is exposed from a second resin surface and spaced apart from a third resin surface in a first direction. the first terminal portion includes a first portion and a second portion. only one set of the first portion passes through the third resin surface. the first portion is spaced apart from the second resin surface in a z direction. the second portion is located on a first side in the z direction relative to the first portion and used for mounting.
