Rohm co., ltd. (20240282657). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240282657 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation: The semiconductor device described in the patent application includes a chip with a main surface, a main surface electrode, a terminal electrode, and a sealing insulator. The terminal electrode is arranged on the main surface electrode, with a part exposed, while the sealing insulator covers the periphery of the terminal electrode, exposing a part of it, and directly covers the main surface electrode.
Key Features and Innovation:
- Chip with main surface, main surface electrode, terminal electrode, and sealing insulator
- Terminal electrode arranged on main surface electrode, exposing a part
- Sealing insulator covers periphery of terminal electrode, exposing a part, and directly covers main surface electrode
Potential Applications: This technology could be used in various semiconductor devices, such as integrated circuits, sensors, and transistors.
Problems Solved: This innovation addresses the need for efficient and reliable semiconductor device packaging and protection.
Benefits:
- Enhanced protection for the main surface and terminal electrodes
- Improved reliability and performance of semiconductor devices
- Simplified manufacturing processes for semiconductor devices
Commercial Applications: The technology could have commercial applications in the electronics industry for the production of advanced semiconductor devices with increased durability and performance.
Prior Art: Readers interested in prior art related to this technology could start by researching semiconductor device packaging and insulation methods.
Frequently Updated Research: Researchers may find updated studies on semiconductor device packaging and insulation techniques relevant to this technology.
Questions about Semiconductor Device Packaging and Insulation: 1. What are the key components of a semiconductor device packaging? 2. How does the sealing insulator in this technology improve the reliability of semiconductor devices?
Original Abstract Submitted
a semiconductor device includes a chip that has a main surface, a main surface electrode that is arranged on the main surface, a terminal electrode that is arranged on the main surface electrode such as to expose a part of the main surface electrode; and a sealing insulator that covers a periphery of the terminal electrode such as to expose a part of the terminal electrode, and that has a portion directly covering the main surface electrode.
