Resonac Corporation Patent Application Trends in 2024
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Contents
Resonac Corporation Patent Filing Activity
Resonac Corporation patent applications in 2024
Top 10 Technology Areas
- C30B29/36 (SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds,)
- H01L21/561 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 6 patents
- Example: 20240006192. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Resonac Corporation)
- H01M10/0525 (PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY)
- C08K2201/001 (Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives)
- H01M2004/027 (PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY)
- C10M107/38 (LUBRICATING COMPOSITIONS (well drilling compositions)
- C10M2213/0606 (LUBRICATING COMPOSITIONS (well drilling compositions)
- H01L21/568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 4 patents
- Example: 20240006192. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Resonac Corporation)
- C08K3/22 (Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives)
- H01M2004/021 (PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY)
Emerging Technology Areas
- H05K2201/0209 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- H05K2203/1377 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- H05K2201/0358 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- H05K2201/10553 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- H01L2924/1435 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20240047230. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Resonac Corporation)
- H01L2224/83815 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20240047230. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Resonac Corporation)
- H01L2224/81815 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20240047230. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Resonac Corporation)
- H01L21/566 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20240047230. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Resonac Corporation)
- H01L21/82 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components)
- C09J7/38 (ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine)
Top Inventors
- Hajime FUNAHASHI (6 patents)
- Yoshishige OKUNO (5 patents)
- Hikaru SATOH (5 patents)
- Hajime YUKUTAKE (5 patents)
- Kazuyuki MITSUKURA (5 patents)
- Shogo SOBUE (5 patents)
- Saeko OGAWA (5 patents)
- Daisuke IKEDA (5 patents)
- Hiroshi YOKOTA (5 patents)
- Shigeru YAMAKI (4 patents)
Patent Categories
Geographical Distribution of Inventors
Geographical Distribution of US Inventors
Categories:
- Pages with broken file links
- Resonac Corporation
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- CPC C07C17/204
- CPC B01J23/10
- CPC B01J23/745
- CPC B01J23/75
- CPC B01J23/755
- CPC B01J27/125
- CPC B01J27/128
- CPC C07C17/208
- CPC G16C20/30
- CPC G16C20/70
- CPC H01M4/587
- CPC H01M2004/021
- CPC H01M2004/027
- CPC H01M10/0525
- CPC C08G65/226
- CPC C10M107/38
- CPC C10M2213/0606
- CPC C10N2040/18
- CPC C09K5/14
- CPC C08K13/06
- CPC C08L83/04
- CPC C08K2003/282
- CPC C08K2201/001
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- CPC C08K2201/006
- CPC C08K2201/014
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- CPC H01L21/32136
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- CPC H01L24/81
- CPC H01L2021/6024
- CPC H01L2224/1181
- CPC H01L2224/11848
- CPC H01L2224/13023
- CPC H01L2224/16225
- CPC H01L2224/81024
- CPC H01L2224/81801
- CPC H01M4/583
- CPC H01M4/366
- CPC B32B27/08
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- CPC B32B27/365
- CPC B32B27/38
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- CPC G01S2013/93271
- CPC C09J171/10
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- CPC H01L29/045
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- CPC H01L21/78
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- CPC C01P2006/12
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- CPC H05K2203/1377
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- Patent Trends by Company in 2024
