Nec corporation (20240160982). QUANTUM DEVICE simplified abstract
Contents
- 1 QUANTUM DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 QUANTUM DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
QUANTUM DEVICE
Organization Name
Inventor(s)
QUANTUM DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240160982 titled 'QUANTUM DEVICE
Simplified Explanation
The abstract of the patent application describes a quantum device consisting of two chips assembled to create a three-dimensional wiring structure. The first chip has a protruding region with terminals on it, extending from the outer periphery of the second chip.
- The quantum device includes a first chip and a second chip assembled to form a three-dimensional wiring structure.
- The first chip has a protruding region with terminals, protruding from the outer periphery of the second chip.
Potential Applications
This technology could be applied in quantum computing, telecommunications, and advanced electronics.
Problems Solved
This innovation solves the problem of creating complex three-dimensional wiring structures in quantum devices efficiently.
Benefits
The benefits of this technology include improved performance, increased efficiency, and compact design in quantum devices.
Potential Commercial Applications
"Three-Dimensional Wiring Structure in Quantum Devices: Commercial Applications"
Possible Prior Art
There may be prior art related to three-dimensional wiring structures in quantum devices, but specific examples are not provided in this article.
Unanswered Questions
How does this technology impact the scalability of quantum devices?
The article does not address how this innovation affects the scalability of quantum devices and whether it enables larger and more complex systems.
What materials are used in the construction of these chips?
The materials used in the construction of the chips are not mentioned in the article, leaving a gap in understanding the physical properties of the quantum device.
Original Abstract Submitted
a quantum device includes a first chip and a second chip that are assembled to configure a three-dimensional wiring structure. the first chip includes a protruding region protruded from a side edge of an outer periphery of the second chip and includes terminals on the protruding region.
