Murata manufacturing co., ltd. (20240347494). SEMICONDUCTOR DEVICE simplified abstract

SEMICONDUCTOR DEVICE

Organization Name

murata manufacturing co., ltd.

Inventor(s)

Mari Saji of Nagaokakyo-shi (JP)

Atsushi Kurokawa of Nagaokakyo-shi (JP)

Masahiro Shibata of Nagaokakyo-shi (JP)

SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240347494 titled 'SEMICONDUCTOR DEVICE

The semiconductor device described in the abstract includes a semiconductor substrate, at least one transistor with multiple semiconductor layers, an electrode for the transistor, an organic insulating film with an opening overlapping the transistor and electrode, and a bump connected to the electrode through the opening.

• The semiconductor device features a transistor with multiple semiconductor layers.
• An organic insulating film with an opening is used to overlap the transistor and electrode.
• A bump is positioned over the transistor and connected to the electrode through the opening.
• The width of the bump is smaller than the width of the opening in the organic insulating film.

Potential Applications: - This technology can be applied in the manufacturing of advanced semiconductor devices. - It can be used in the development of high-performance electronic devices.

Problems Solved: - Provides a solution for connecting electrodes to transistors in a compact and efficient manner. - Ensures proper electrical connections in semiconductor devices.

Benefits: - Improved performance and reliability of semiconductor devices. - Enhanced efficiency in the manufacturing process.

Commercial Applications: Title: Advanced Semiconductor Device Technology for Enhanced Performance This technology can be utilized in the production of smartphones, tablets, and other consumer electronics. It can also find applications in the automotive industry for advanced driver assistance systems.

Questions about the technology: 1. How does the size of the bump impact the overall performance of the semiconductor device? 2. What are the potential challenges in implementing this technology in mass production?

Frequently Updated Research: Researchers are constantly exploring ways to further optimize the design and functionality of semiconductor devices using similar innovative approaches. Stay updated on the latest advancements in semiconductor technology for potential improvements in performance and efficiency.

Original Abstract Submitted

a semiconductor device includes a semiconductor substrate; at least one transistor located on the semiconductor substrate and including a plurality of semiconductor layers; an electrode provided for the transistor; an organic insulating film having an opening in a region overlapping the transistor and the electrode in plan view in a first direction perpendicular to the semiconductor substrate; and a bump located over the at least one transistor in plan view in the first direction and electrically connected to the electrode through the opening of the organic insulating film. the width of the bump in a second direction parallel to the semiconductor substrate is smaller than the width of the opening of the organic insulating film in the second direction.