Mitsubishi electric corporation (20240347403). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
mitsubishi electric corporation
Inventor(s)
Takeshi Higashihata of Tokyo (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240347403 titled 'SEMICONDUCTOR DEVICE
The abstract describes a patent application for a technology involving an insulation substrate on a heat dissipation plate, with a semiconductor chip mounted on the substrate and surrounded by a case adhered to the plate with a silicone adhesive. A wire bond is provided between the insulation layer in the substrate and the inner wall of the case.
- Insulation substrate on a heat dissipation plate
- Semiconductor chip mounted on the insulation substrate
- Case surrounding the substrate and chip, adhered to the heat dissipation plate with a silicone adhesive
- Wire bond between the insulation layer in the substrate and the inner wall of the case
Potential Applications: - Electronics manufacturing - Semiconductor industry - Thermal management systems
Problems Solved: - Efficient heat dissipation - Secure mounting of semiconductor chips - Protection of sensitive electronic components
Benefits: - Improved thermal performance - Enhanced reliability of electronic devices - Simplified manufacturing processes
Commercial Applications: Title: "Advanced Thermal Management System for Electronics" This technology can be used in various electronic devices such as smartphones, computers, and automotive electronics to improve thermal performance and overall reliability.
Questions about the technology: 1. How does the wire bond contribute to the overall functionality of the system? 2. What are the specific advantages of using a silicone adhesive in this context?
Frequently Updated Research: Researchers are constantly exploring new materials and techniques to enhance thermal management in electronic devices, which could lead to further advancements in this technology.
Original Abstract Submitted
an insulation substrate () is provided on a beat dissipation plate (). a semiconductor chip () is mounted on the insulation substrate (). a case () is adhered to a peripheral portion of the heat dissipation plate () with a silicone adhesive () to surround the insulation substrate () and the semiconductor chip (). a wire bond () is provided on the heat dissipation plate () between an outer periphery of an insulation layer () in the insulation substrate () and an inner wall of the case ().
