Mitsubishi electric corporation (20240243071). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
mitsubishi electric corporation
Inventor(s)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240243071 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation: The semiconductor device described in the patent application includes a conductive pattern on an insulating substrate, with multiple semiconductor chips mounted on it. The semiconductor chips consist of a first chip and two or more second chips connected in parallel. The conductive pattern beneath the first chip is thicker than that beneath the second chips to reduce thermal interference.
- The semiconductor device has a conductive pattern on an insulating substrate.
- Multiple semiconductor chips are mounted on the conductive pattern.
- The semiconductor chips include a first chip and two or more second chips connected in parallel.
- The first chip is more susceptible to thermal interference than the second chips.
- The conductive pattern beneath the first chip is thicker than that beneath the second chips.
Potential Applications: 1. Electronics manufacturing 2. Semiconductor industry 3. Integrated circuit design
Problems Solved: 1. Thermal interference in semiconductor devices 2. Ensuring stable performance of semiconductor chips
Benefits: 1. Improved reliability of semiconductor devices 2. Enhanced thermal management 3. Increased efficiency in electronic systems
Commercial Applications: The technology can be utilized in the production of various electronic devices, such as smartphones, computers, and automotive systems, to enhance their performance and reliability.
Prior Art: Researchers can explore prior patents related to semiconductor chip mounting techniques and thermal management in electronic devices to gain insights into existing technologies in this field.
Frequently Updated Research: Researchers are constantly exploring new methods to improve thermal management in semiconductor devices and enhance the performance of integrated circuits.
Questions about Semiconductor Device Technology: 1. How does the thickness of the conductive pattern impact thermal interference in semiconductor chips? 2. What are the potential implications of using multiple semiconductor chips connected in parallel in electronic devices?
Original Abstract Submitted
a semiconductor device includes a conductive pattern and a plurality of semiconductor chips. the conductive pattern is provided on an insulating substrate. the plurality of semiconductor chips is mounted on the conductive pattern. the plurality of semiconductor chips includes a first semiconductor chip and two or more second semiconductor chips electrically connected in parallel to each other. the first semiconductor chip is more likely to be affected by thermal interference than the two or more second semiconductor chips. a thickness of the conductive pattern immediately below the first semiconductor chip is larger than a thickness of the conductive pattern immediately below each of the two or more second semiconductor chips.
