Micron technology, inc. (20240347413). THERMALLY REGULATED SEMICONDUCTOR DEVICE simplified abstract
Contents
THERMALLY REGULATED SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Chen Yu Huang of Taichung (TW)
Chong Leong Gan of Taichung (TW)
THERMALLY REGULATED SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240347413 titled 'THERMALLY REGULATED SEMICONDUCTOR DEVICE
Simplified Explanation:
This patent application describes a semiconductor device assembly that includes a substrate, one or more semiconductor dies, and a thermally conductive material, such as carbon nanotubes or graphene, to dissipate heat from the assembly. By incorporating this thermally conductive material, the semiconductor device can be thermally regulated effectively.
- The semiconductor device assembly includes a substrate and one or more semiconductor dies.
- A thermally conductive material, such as carbon nanotubes or graphene, is used to dissipate heat from the assembly.
- The incorporation of the thermally conductive material allows for effective thermal regulation of the semiconductor device.
Potential Applications:
The technology described in this patent application could be applied in various electronic devices that require efficient heat dissipation, such as computers, smartphones, and other consumer electronics. It could also be beneficial in industrial applications where thermal management is critical.
Problems Solved:
This technology addresses the problem of heat buildup in semiconductor devices, which can lead to performance degradation and even failure. By effectively dissipating heat, the semiconductor device assembly can operate more efficiently and reliably.
Benefits:
- Improved thermal regulation of semiconductor devices - Enhanced performance and reliability - Extended lifespan of electronic devices
Commercial Applications:
The technology could have significant commercial applications in the electronics industry, leading to the development of more efficient and reliable electronic devices. It could also open up opportunities for companies specializing in thermal management solutions.
Questions about Semiconductor Device Assembly:
1. How does the thermally conductive material, such as carbon nanotubes or graphene, help dissipate heat in the semiconductor device assembly? 2. What are the potential implications of using this technology in consumer electronics and industrial applications?
Original Abstract Submitted
a semiconductor device assembly is provided. the semiconductor device assembly can include a substrate and one or more semiconductor dies. the semiconductor device assembly can further include a thermally conductive material (e.g., carbon nanotubes, graphene) capable of dissipating heat from the semiconductor device assembly. in doing so, a thermally regulated semiconductor device can be assembled.
