Micron technology, inc. (20240306403). STACKED SEMICONDUCTOR DEVICE simplified abstract
Contents
STACKED SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Yeon Seung Jung of Hwaseong (KR)
STACKED SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240306403 titled 'STACKED SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract includes a substrate with two stacks of semiconductor dies staggered in a way that their footprints partially overlap. The semiconductor dies are alternated and vertically mounted to each other, with conductive structures extending between them to electrically couple the dies.
- Staggered arrangement of two stacks of semiconductor dies on a substrate
- Overlapping footprints of the semiconductor dies in the two stacks
- Alternating and vertically mounting semiconductor dies from each stack
- Conductive structures for electrical coupling between the dies
Potential Applications: - Integrated circuits - Microprocessors - Memory devices
Problems Solved: - Efficient use of space on a substrate - Enhanced electrical coupling between semiconductor dies
Benefits: - Increased density of semiconductor dies on a substrate - Improved electrical performance - Cost-effective manufacturing process
Commercial Applications: Title: "Innovative Semiconductor Device for Enhanced Performance" This technology can be used in various industries such as electronics, telecommunications, and computing for the development of high-performance semiconductor devices.
Prior Art: Researchers can explore prior patents related to semiconductor device stacking, vertical mounting, and electrical coupling for further insights into the innovation described in this patent application.
Frequently Updated Research: Researchers and industry professionals can stay updated on advancements in semiconductor device technology, particularly in the area of stacked die configurations and electrical coupling methods.
Questions about Semiconductor Device Stacking: 1. How does the staggered arrangement of semiconductor dies on a substrate improve performance? - The staggered arrangement allows for increased density of semiconductor dies, optimizing space utilization and enhancing electrical coupling between the dies.
2. What are the potential challenges associated with vertically mounting semiconductor dies in a stacked configuration? - Challenges may include thermal management, signal interference, and manufacturing complexity, which need to be addressed for successful implementation of the technology.
Original Abstract Submitted
a semiconductor device is provided that can include a substrate and a first and second stack of semiconductor dies coupled to the substrate. the first stack of semiconductor dies and the second stack of semiconductor dies are staggered such that the first stack of semiconductor dies has a first footprint and the second stack of semiconductor dies has a second footprint that partially overlaps the first footprint. the first stack of semiconductor dies and the second stack of semiconductor dies are alternated such that each semiconductor die of the first stack of semiconductor dies is vertically mounted to a respective semiconductor die of the second stack of semiconductor dies. conductive structures extend between portions of the first and second stacks of semiconductor dies exposed beyond the second footprint and the first footprint, respectively, to electrically couple the semiconductor dies.
