Kabushiki kaisha toshiba (20240321813). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Syotaro Ono of Kanazawa Ishikawa (JP)
Hisao Ichijo of Kanazawa Ishikawa (JP)
Hiroaki Yamashita of Kanazawa Ishikawa (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321813 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract includes a die pad, a semiconductor chip with a rectangular shape and element region, first and second electrodes, a first connector above the termination region, and a sealing resin.
- Die pad with an upper surface
- Semiconductor chip with a rectangular shape, element region, and termination region
- First and second electrodes on the semiconductor chip
- First connector covering the four sides of the rectangular shape and connected to the first electrode
- Sealing resin sealing the periphery of the semiconductor chip and first connector
Potential Applications: - Integrated circuits - Electronic devices - Semiconductor manufacturing
Problems Solved: - Efficient electrical connections in semiconductor devices - Protection and sealing of semiconductor chips
Benefits: - Improved performance of electronic devices - Enhanced durability and reliability of semiconductor components
Commercial Applications: Title: "Advanced Semiconductor Devices for Enhanced Electronics" This technology can be used in various electronic devices, leading to improved functionality and performance. The market implications include increased demand for high-quality semiconductor components in the electronics industry.
Prior Art: Researchers can explore prior patents related to semiconductor device packaging and electrical connections to understand the evolution of this technology.
Frequently Updated Research: Researchers can stay updated on advancements in semiconductor packaging techniques, materials, and design considerations to enhance the performance of semiconductor devices.
Questions about Semiconductor Devices: 1. How does the design of the first connector contribute to the overall performance of the semiconductor device? 2. What are the key factors to consider when selecting a sealing resin for semiconductor chip protection?
Original Abstract Submitted
a semiconductor device according to an embodiment includes: a die pad including an upper surface; a semiconductor chip provided on the upper surface, the semiconductor chip including a rectangular shape, and the semiconductor chip including an element region, and a termination region surrounding the element region; a first electrode provided on the semiconductor chip; a second electrode provided on the semiconductor chip; a first connector provided above the termination region, the first connector including a portion covering each of the four sides of the rectangular shape when viewed from above, and the first connector being electrically connected to the first electrode; and a sealing resin sealing a periphery of the semiconductor chip and the first connector.
