Kabushiki kaisha toshiba (20240321812). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Takeshi Murasaki of Yokohama Kanagawa (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321812 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation: This patent application describes a semiconductor device that includes a substrate, a semiconductor chip, and a capacitor. The substrate has a grounding terminal at the same potential as the substrate, the semiconductor chip is connected to the grounding terminal, and the capacitor is connected to the chip or analog circuit.
- The semiconductor device includes a substrate, semiconductor chip, and capacitor.
- The substrate has a grounding terminal at the same potential as the substrate.
- The semiconductor chip is connected to the grounding terminal via a bonding wire.
- The chip includes a circuit driven with a predetermined clock frequency and an analog circuit.
- The capacitor is connected to either the circuit or analog circuit via a connection wire.
Potential Applications: 1. Integrated circuits 2. Electronic devices 3. Semiconductor manufacturing
Problems Solved: 1. Ensuring proper grounding in semiconductor devices 2. Enhancing circuit performance 3. Improving signal integrity
Benefits: 1. Enhanced reliability of semiconductor devices 2. Improved performance of integrated circuits 3. Better signal quality in electronic devices
Commercial Applications: The technology can be applied in the development of advanced electronic devices, integrated circuits, and semiconductor components, catering to industries such as telecommunications, consumer electronics, and automotive.
Questions about Semiconductor Devices: 1. How does the capacitor improve the performance of the semiconductor chip? 2. What are the potential challenges in implementing this technology in mass production?
Frequently Updated Research: Researchers are continually exploring ways to enhance the efficiency and functionality of semiconductor devices through advancements in materials, design, and manufacturing processes. Stay updated on the latest developments in the field for insights into future innovations.
Original Abstract Submitted
according to the present embodiment, a semiconductor device includes a substrate, a semiconductor chip, and a capacitor. the substrate includes at least a grounding terminal and is at the same potential as the grounding terminal. the semiconductor chip is arranged on the substrate and connected to the grounding terminal via a first bonding wire, and includes a circuit driven with a predetermined clock frequency and an analog circuit. the capacitor is arranged on the substrate and connected to at least either the circuit or the analog circuit at one end via a connection wire.
