Kabushiki kaisha toshiba (20240321808). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Kazuki Matsuo of Nonoichi Ishikawa (JP)
Masatoshi Arai of Hakusan Ishikawa (JP)
Rie Fujimoto of Komatsu Ishikawa (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321808 titled 'SEMICONDUCTOR DEVICE
The semiconductor chip described in the abstract includes a metallic film, an insulating film with an opening, a bonding material in the opening, and a connector with a bonding surface and an annular groove.
- Metallic film provided on a semiconductor chip
- Insulating film with an opening on the metallic film
- Bonding material in the opening bonded to the metallic film
- Connector with a bonding surface bonded to the bonding material
- Annular groove on the bonding surface along its periphery
Potential Applications: - Semiconductor industry for electronic devices - Integrated circuits - Microprocessors
Problems Solved: - Enhanced bonding between metallic film and connector - Improved reliability and performance of semiconductor chips
Benefits: - Increased durability and stability of semiconductor chips - Enhanced electrical conductivity - Improved overall functionality of electronic devices
Commercial Applications: Title: Advanced Semiconductor Chip Bonding Technology This technology can be utilized in various electronic devices such as smartphones, laptops, and tablets, improving their performance and reliability. The market implications include increased demand for high-quality semiconductor chips in the electronics industry.
Prior Art: Researchers can explore patents related to semiconductor chip bonding technology, metallic film applications in electronic devices, and connector design in the semiconductor industry.
Frequently Updated Research: Researchers are constantly developing new methods to enhance semiconductor chip bonding technology, improve materials used in electronic devices, and optimize connector designs for better performance.
Questions about Semiconductor Chip Bonding Technology: 1. How does the annular groove on the connector's bonding surface improve the bonding process? 2. What are the potential challenges in implementing this advanced bonding technology in mass production?
Original Abstract Submitted
a semiconductor chip according to an embodiment includes a metallic film provided on a semiconductor chip; an insulating film provided on the metallic film and having an opening; a bonding material provided on the metal film in the opening, and the bonding material being bonded to the metallic film; and a connector including a bonding surface bonded to the bonding material, and an annular groove provided on the bonding surface, the annular groove being along the periphery of the bonding surface, and an inner diameter of the annular groove being 60% or more and 90% or less of an outer diameter of the annular groove.
