Kabushiki kaisha toshiba (20240321697). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Toru Shono of Himeji Hyogo (JP)
Naoya Nishijima of Ibo Hyogo (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321697 titled 'SEMICONDUCTOR DEVICE
The embodiment described in the abstract of this patent application includes a semiconductor portion, electrodes, control electrodes, a conductive plate, and bonding material, arranged in a specific configuration.
- The semiconductor portion, electrodes, and control electrodes are positioned above the semiconductor portion, while the conductive plate is located below it.
- A thin portion, thinner than a mounting portion, is present in the structure.
- In a plan view, the semiconductor portion and the conductive plate are rectangular, with the conductive plate having a mounting portion where the semiconductor portion is mounted and a thin portion surrounding it.
- The vertices of the semiconductor portion are situated in the thin portion.
Potential Applications: - This technology could be used in semiconductor devices for various electronic applications. - It may find applications in the manufacturing of sensors or actuators.
Problems Solved: - This design helps in optimizing the performance and functionality of semiconductor devices. - It provides a stable and efficient configuration for electronic components.
Benefits: - Improved performance and reliability of semiconductor devices. - Enhanced control and functionality in electronic applications.
Commercial Applications: Title: Advanced Semiconductor Device Structure for Enhanced Performance This technology could be utilized in the production of high-performance electronic devices, leading to advancements in various industries such as telecommunications, consumer electronics, and automotive.
Questions about the technology: 1. How does the positioning of the electrodes and control electrodes contribute to the overall functionality of the semiconductor device? 2. What are the specific advantages of having a thin portion in the structure compared to a uniform thickness design?
Frequently Updated Research: Stay updated on the latest advancements in semiconductor device structures and their applications in electronic devices for continued innovation and development in the field.
Original Abstract Submitted
an embodiment includes a semiconductor portion, a first electrode, a second electrode, a first control electrode, a second control electrode, a conductive plate, and a bonding material. the first electrode, the second electrode, the first control electrode, and the second control electrode are provided above the semiconductor portion. the conductive plate is provided below the semiconductor portion. the bonding material is provided between the semiconductor portion and the conductive plate. a thin portion is thinner than a mounting portion. in a plan view, the semiconductor portion and the conductive plate are rectangular, and the conductive plate includes the mounting portion on which the semiconductor portion is mounted and the thin portion surrounding the mounting portion. vertices of the semiconductor portion are located in the thin portion.
