Kabushiki kaisha toshiba (20240321696). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Riku Katamawari of Nonoichi Ishikawa (JP)
Hideharu Kojima of Kanazawa Ishikawa (JP)
Takeyuki Suzuki of Kaga Ishikawa (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321696 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract consists of a lead frame and a semiconductor chip, where the chip is bonded to a convex portion on the frame's main surface.
- The semiconductor chip includes a semiconductor layer with an electrode on its bottom surface, which is connected to the frame's convex portion.
- The electrode of the semiconductor chip has a protrusion surrounding the frame convex portion, with the outer side surface of the protrusion flush with a side surface of the semiconductor layer.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, computers, and automotive systems. - It can also be applied in industrial machinery, medical equipment, and communication devices.
Problems Solved: - Provides a secure and reliable connection between the semiconductor chip and the lead frame. - Ensures proper electrical conductivity and stability in electronic devices.
Benefits: - Improved performance and longevity of electronic devices. - Enhanced durability and resistance to external factors. - Simplified manufacturing processes and cost-effectiveness.
Commercial Applications: Title: Advanced Semiconductor Device Technology for Enhanced Electronic Performance This technology can be utilized in the production of consumer electronics, automotive electronics, industrial machinery, and medical devices. It offers manufacturers a reliable solution for improving the performance and durability of their products, leading to increased customer satisfaction and market competitiveness.
Prior Art: Readers can explore prior art related to semiconductor device packaging, lead frame technology, and semiconductor chip bonding methods to gain a deeper understanding of the evolution of this technology.
Frequently Updated Research: Researchers are continuously exploring advancements in semiconductor packaging techniques, lead frame materials, and bonding technologies to enhance the efficiency and reliability of semiconductor devices.
Questions about Semiconductor Device Technology: 1. How does the protrusion on the electrode of the semiconductor chip contribute to the overall stability of the device? The protrusion ensures a secure and stable connection between the semiconductor chip and the lead frame, enhancing the device's performance and longevity.
2. What are the potential challenges in implementing this semiconductor device technology on a larger scale in various industries? Scaling up the production of semiconductor devices using this technology may require adjustments in manufacturing processes and materials to meet the specific requirements of different industries.
Original Abstract Submitted
a semiconductor device according to the present embodiment includes a lead frame and a semiconductor chip. the lead frame includes a frame main surface and a frame convex portion provided on the frame main surface. the semiconductor chip includes a semiconductor layer and an electrode provided on a bottom surface of the semiconductor layer and bonded to the frame convex portion. the electrode of the semiconductor chip has a protrusion surrounding the frame convex portion, and an outer side surface of the protrusion is flush with a side surface of the semiconductor layer.
