International business machines corporation (20240282735). SOLDER VOLUME FOR FLIP-CHIP BONDING simplified abstract
Contents
SOLDER VOLUME FOR FLIP-CHIP BONDING
Organization Name
international business machines corporation
Inventor(s)
Toyohiro Aoki of Yokohama (JP)
Katsuyuki Sakuma of Fishkill NY (US)
Hiroyuki Mori of Yasu-shi (JP)
Koki Nakamura of Kawasaki (JP)
Takashi Hisada of Hachiouji-shi (JP)
SOLDER VOLUME FOR FLIP-CHIP BONDING - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240282735 titled 'SOLDER VOLUME FOR FLIP-CHIP BONDING
The abstract describes methods, systems, and structures related to flip-chip bonding. A processor determines target solder volumes to be deposited on pads on a substrate, with variable volumes among the pads. Different thicknesses of resist are deposited across the substrate to define solder resist openings that match the target solder volumes.
- Processor determines target solder volumes for pads on substrate
- Variable solder volumes among the pads
- Different resist thicknesses define solder resist openings
- Sizes of openings comply with target solder volumes
- Innovation in flip-chip bonding technology
Potential Applications: - Semiconductor manufacturing - Electronics assembly - Microelectronics packaging
Problems Solved: - Ensuring precise solder volumes on pads - Improving flip-chip bonding accuracy - Enhancing overall product reliability
Benefits: - Increased efficiency in manufacturing processes - Enhanced product performance and durability - Cost-effective solution for flip-chip bonding
Commercial Applications: Title: Advanced Flip-Chip Bonding Technology for Semiconductor Industry This technology can be utilized in the semiconductor industry for manufacturing advanced electronic devices, improving production efficiency, and ensuring high-quality products for consumers. The market implications include increased competitiveness, improved product reliability, and potential cost savings for manufacturers.
Prior Art: Researchers can explore prior art related to flip-chip bonding techniques, solder deposition methods, and resist layer thickness control in semiconductor manufacturing processes.
Frequently Updated Research: Researchers in the field of microelectronics and semiconductor manufacturing may conduct ongoing studies on flip-chip bonding technologies, solder deposition techniques, and resist material properties to enhance the efficiency and reliability of electronic devices.
Questions about Flip-Chip Bonding: 1. How does variable solder volume deposition improve the flip-chip bonding process? 2. What are the key factors influencing the thickness control of resist layers in flip-chip bonding applications?
Original Abstract Submitted
methods, systems, and structures relating to flip-chip bonding are described. a processor can determine a plurality of target solder volumes to be deposited on a plurality of pads on a surface of a substrate. the plurality of target solder volumes can be variable among the plurality of pads. the processor can determine different thicknesses of different portions of a layer of resist to be deposited across the surface of the substrate. the different thicknesses can define a plurality of solder resist openings having sizes that comply with the plurality of target solder volumes.
