International business machines corporation (20240282658). INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER simplified abstract

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INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER

Organization Name

international business machines corporation

Inventor(s)

John Knickerbocker of Monroe NY (US)

Mukta Ghate Farooq of HOPEWELL JCT NY (US)

Keiji Matsumoto of Yokohama-shi (JP)

INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240282658 titled 'INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER

The abstract of a patent application describes a semiconductor integrated circuit device with a thermally conducting solder surrounding the front-end-of-line region and back-end-of-line regions.

  • The semiconductor integrated circuit device includes a first back-end-of-line region connected to one side of the front-end-of-line region.
  • A second back-end-of-line region is connected to the other side of the front-end-of-line region.
  • A thermally conducting solder partially surrounds the perimeter of the front-end-of-line region, as well as the first and second back-end-of-line regions.

Potential Applications: - This technology could be used in the manufacturing of high-performance integrated circuits. - It may find applications in the aerospace industry where reliability and thermal management are crucial.

Problems Solved: - Provides improved thermal conductivity in semiconductor devices. - Enhances the overall performance and reliability of integrated circuits.

Benefits: - Better heat dissipation in semiconductor devices. - Increased efficiency and longevity of integrated circuits.

Commercial Applications: Title: Enhanced Thermal Management in Semiconductor Devices This technology could be utilized in the production of advanced electronics, data centers, and telecommunications equipment, improving their performance and reliability.

Prior Art: Researchers can explore prior patents related to thermal management in semiconductor devices, soldering techniques, and integrated circuit design.

Frequently Updated Research: Researchers are constantly working on improving thermal management techniques in semiconductor devices to enhance their performance and reliability.

Questions about Semiconductor Integrated Circuit Devices: 1. How does the thermally conducting solder improve the performance of semiconductor devices? 2. What are the potential challenges in implementing this technology in mass production?


Original Abstract Submitted

a semiconductor integrated circuit device includes a first back-end-of-line region coupled to a first side of a front-end-of-line region, a second back-end-of-line region coupled to a second side of the front-end-of-line region, and a thermally conducting solder at least partially surrounding a perimeter of the front-end-of-line region, the first back-end-of-line region and the second back-end-of-line region.

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