Intel corporation (20240355725). POWER DELIVERY STRUCTURES simplified abstract

POWER DELIVERY STRUCTURES

Organization Name

intel corporation

Inventor(s)

Adel Elsherbini of Tempe AZ (US)

Feras Eid of Chandler AZ (US)

Georgios Dogiamis of Chandler AZ (US)

Beomseok Choi of Chandler AZ (US)

Henning Braunisch of Phoenix AZ (US)

William Lambert of Tempe AZ (US)

Krishna Bharath of Chandler AZ (US)

Johanna Swan of Scottsdale AZ (US)

POWER DELIVERY STRUCTURES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240355725 titled 'POWER DELIVERY STRUCTURES

The abstract describes an integrated circuit assembly with an electronic substrate and an integrated circuit device attached to it. The device has through-substrate vias extending into it from one surface, with power delivery routes conformal to the device's side and the substrate's surface.

• Integrated circuit assembly with electronic substrate and attached device
• Through-substrate vias in the device for electrical connection
• Power delivery routes conformal to device's side and substrate's surface
• Electrical attachment between device and substrate
• Enhanced power delivery efficiency and reliability

Potential Applications: - Electronics manufacturing - Semiconductor industry - Telecommunications - Consumer electronics

Problems Solved: - Improved power delivery in integrated circuits - Enhanced electrical connections - Increased reliability in electronic devices

Benefits: - Higher efficiency in power delivery - Enhanced performance of integrated circuits - Improved reliability of electronic devices

Commercial Applications: Title: Enhanced Power Delivery in Integrated Circuits: Commercial Uses and Market Implications This technology can be utilized in various industries such as electronics manufacturing, semiconductor production, telecommunications, and consumer electronics, leading to more efficient and reliable electronic devices.

Prior Art: Readers can explore prior research in the fields of integrated circuit design, power delivery in electronics, and semiconductor manufacturing to understand the evolution of this technology.

Frequently Updated Research: Stay updated on the latest advancements in integrated circuit design, power delivery technologies, and semiconductor manufacturing processes to enhance your understanding of this innovative technology.

Questions about Integrated Circuit Assembly: 1. How does the through-substrate via technology improve power delivery in integrated circuits? 2. What are the key advantages of using conformal power delivery routes in electronic devices?

Original Abstract Submitted

an integrated circuit assembly may be fabricated having an electronic substrate, an integrated circuit device having a first surface, an opposing second surface, at least one side extending between the first surface and the second surface, and at least one through-substrate via extending into the integrated circuit device from the second surface, wherein the first surface of the integrated circuit device is electrically attached to the electronic substrate; and at least one power delivery route electrically attached to the second surface of the integrated circuit device and to the electronic substrate, wherein the at least one power delivery route is conformal to the side of the integrated circuit device and the first surface of the electronic substrate.