Intel corporation (20240345324). OPTICAL FIBER MOUNTS FOR PRINTED CIRCUIT BOARDS AND INTEGRATED CIRCUIT DEVICE PACKAGES simplified abstract
Contents
OPTICAL FIBER MOUNTS FOR PRINTED CIRCUIT BOARDS AND INTEGRATED CIRCUIT DEVICE PACKAGES
Organization Name
Inventor(s)
Benjamin Duong of Phoenix AZ (US)
Kristof Darmawikarta of Chandler AZ (US)
Soham Agarwal of Chandler AZ (US)
Marcel Said of Beaverton OR (US)
Sandeep Gaan of Phoenix AZ (US)
OPTICAL FIBER MOUNTS FOR PRINTED CIRCUIT BOARDS AND INTEGRATED CIRCUIT DEVICE PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240345324 titled 'OPTICAL FIBER MOUNTS FOR PRINTED CIRCUIT BOARDS AND INTEGRATED CIRCUIT DEVICE PACKAGES
Simplified Explanation: The patent application describes an integrated circuit package with a substrate that has a mounting surface for an integrated circuit device, as well as at least one optical fiber mount. The optical fiber mount includes a support with at least one optical fiber mounting channel designed to hold at least one clad optical fiber.
Key Features and Innovation:
- Integrated circuit package with optical fiber mount
- Substrate with integrated circuit device mounting surface
- Optical fiber mount with support and mounting channel
- Designed to hold clad optical fibers
Potential Applications: This technology could be used in telecommunications, data transmission, and sensor applications where optical fibers are required for high-speed data transfer.
Problems Solved: This technology addresses the challenge of integrating optical fibers into integrated circuit packages, allowing for more efficient data transmission and communication.
Benefits:
- Improved data transmission speeds
- Enhanced communication capabilities
- Compact and integrated design
Commercial Applications: Title: Integrated Circuit Package with Optical Fiber Mount: Commercial Uses and Market Implications This technology could be valuable in industries such as telecommunications, networking, and sensor manufacturing, where high-speed data transfer and communication are essential.
Prior Art: Readers interested in prior art related to this technology could explore patents and research papers on integrated circuit packaging, optical fiber integration, and data transmission technologies.
Frequently Updated Research: Researchers in the field of integrated circuit packaging and optical fiber integration may find relevant and up-to-date information in journals, conferences, and industry publications.
Questions about Integrated Circuit Package with Optical Fiber Mount: 1. What are the potential challenges in integrating optical fibers into integrated circuit packages? 2. How does this technology improve data transmission efficiency and speed?
Original Abstract Submitted
an integrated circuit package includes a substrate with an integrated circuit device mounting surface, and at least one optical fiber mount in the substrate. the optical fiber mount includes a support having at least one optical fiber mounting channel, and the optical fiber mounting channel is configured to mount at least one clad optical fiber.
