Intel corporation (20240339381). AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTERPOSER simplified abstract

AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTERPOSER

Organization Name

intel corporation

Inventor(s)

Hiroki Tanaka of Gilbert AZ (US)

Veronica Strong of Hillsboro OR (US)

Henning Braunisch of Phoenix AZ (US)

Haobo Chen of Gilbert AZ (US)

Jeremy D. Ecton of Gilbert AZ (US)

Kristof Darmawikarta of Chandler AZ (US)

Brandon C. Marin of Gilbert AZ (US)

AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTERPOSER - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240339381 titled 'AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTERPOSER

The abstract of the patent application describes an interposer with a glass layer substrate and traces with exposed sidewall surfaces and a trench adjacent to the trace.

• The interposer includes a substrate with a glass layer.
• Traces on the substrate have exposed sidewall surfaces and a trench adjacent to at least one sidewall surface.
• The traces have bottom surfaces, sidewall surfaces, and top surfaces.
• The top surfaces and sidewall surfaces of the traces are exposed to air.

Potential Applications: - Semiconductor packaging - Microelectronics - Integrated circuits

Problems Solved: - Improved signal integrity - Enhanced thermal performance - Increased reliability in electronic devices

Benefits: - Better performance in electronic devices - Higher efficiency in signal transmission - Improved durability and longevity of components

Commercial Applications: Title: Advanced Interposer Technology for Enhanced Semiconductor Packaging This technology can be used in the manufacturing of advanced electronic devices, such as smartphones, tablets, and computers, to improve their performance and reliability.

Questions about Interposer Technology: 1. How does the use of a glass layer substrate benefit the interposer design? Glass layer substrates provide excellent thermal and electrical properties, enhancing the overall performance of the interposer.

2. What advantages do exposed sidewall surfaces offer in the trace design? Exposed sidewall surfaces help in reducing signal interference and improving signal integrity in electronic devices.

Original Abstract Submitted

embodiments disclosed herein include an interposer. in an embodiment, the interposer comprises a substrate, where the substrate comprises a glass layer. in an embodiment, a trace is on the substrate, where the trace has a bottom surface, sidewall surfaces, and a top surface. in an embodiment, the sidewall surfaces and the top surface are exposed to air. in an embodiment, a trench into the substrate is adjacent to at least one sidewall surface of the trace.