Intel corporation (20240319457). UNDERCUT ARCHITECTURES FOR IMPROVED THERMAL EFFICIENCY IN PHOTONIC INTEGRATED CIRCUIT (PIC) ARCHITECTURES simplified abstract
UNDERCUT ARCHITECTURES FOR IMPROVED THERMAL EFFICIENCY IN PHOTONIC INTEGRATED CIRCUIT (PIC) ARCHITECTURES
Organization Name
Inventor(s)
Chia-Pin Chiu of Tempe AZ (US)
Kaveh Hosseini of Livermore CA (US)
UNDERCUT ARCHITECTURES FOR IMPROVED THERMAL EFFICIENCY IN PHOTONIC INTEGRATED CIRCUIT (PIC) ARCHITECTURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240319457 titled 'UNDERCUT ARCHITECTURES FOR IMPROVED THERMAL EFFICIENCY IN PHOTONIC INTEGRATED CIRCUIT (PIC) ARCHITECTURES
Simplified Explanation: In one embodiment, a photonic integrated circuit (PIC) device includes conductive pads, a micro ring resonator (MRR) with a heater element, a cavity, and holes defined within the substrate of the PIC.
- The PIC device has conductive pads on its surface and a centrally located heater element in the MRR.
- A cavity is defined within the substrate below the MRR, and holes are present between the MRR and the conductive pads.
- The holes extend from the top surface of the PIC into the cavity, with each hole located between a conductive pad and the MRR.
Key Features and Innovation:
- Integration of conductive pads, MRR with a heater element, cavity, and holes in a PIC device.
- Central location of the heater element in the MRR for efficient heating.
- Holes extending from the top surface of the PIC into the cavity for enhanced functionality.
Potential Applications: The technology can be applied in telecommunications, optical signal processing, and sensing applications.
Problems Solved:
- Efficient heating of the MRR in a PIC device.
- Enhanced functionality and performance in optical applications.
Benefits:
- Improved heating efficiency.
- Enhanced functionality and performance in optical applications.
Commercial Applications: Potential commercial applications include telecommunications equipment, optical sensors, and data communication devices.
Questions about Photonic Integrated Circuit (PIC) Devices: 1. What are the key components of a photonic integrated circuit (PIC) device? 2. How does the integration of conductive pads, MRR, cavity, and holes enhance the functionality of a PIC device?
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Original Abstract Submitted
in one embodiment, a photonic integrated circuit (pic) device includes conductive pads on a surface of the pic and a micro ring resonator (mrr) with a heater element centrally located between the conductive pads. the pic also includes a cavity defined within a substrate of the pic below the mrr, and a plurality of holes defined between the mrr and the conductive pads. the holes extend from a top surface of the pic into the cavity, and each hole is between a respective conductive pad and the mrr.
