Intel corporation (20240312865). METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE

Organization Name

intel corporation

Inventor(s)

Kyle Arrington of Gilbert AZ (US)

Bohan Shan of Chandler AZ (US)

Haobo Chen of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Srinivas Pietambaram of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Ziyin Lin of Chandler AZ (US)

Hongxia Feng of Chandler AZ (US)

Yiqun Bai of Chandler AZ (US)

Xiaoying Guo of Chandler AZ (US)

Dingying Xu of Chandler AZ (US)

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240312865 titled 'METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE RELIABILITY OF VIAS IN A GLASS SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE

The patent application relates to methods, systems, apparatus, and articles of manufacture aimed at improving the reliability of vias in a glass substrate of an integrated circuit package.

• The innovation involves an integrated circuit package substrate with a glass substrate, a via extending between first and second surfaces of the glass substrate, and a conductive material containing gallium and silver provided in the via.

• The use of gallium and silver in the conductive material enhances the reliability of the vias in the glass substrate, ensuring better performance and longevity of the integrated circuit package.

• By incorporating this novel conductive material, the patent aims to address issues related to via reliability in glass substrates commonly used in integrated circuit packages.

• The technology offers a practical solution to improve the overall quality and durability of integrated circuit packages, particularly in applications where reliable vias are crucial for optimal performance.

• The integration of gallium and silver in the conductive material of the vias represents a significant advancement in enhancing the reliability and functionality of glass substrate-based integrated circuit packages.

Potential Applications: The technology can be applied in various industries where integrated circuit packages with glass substrates are utilized, such as electronics, telecommunications, and automotive sectors.

Problems Solved: The technology addresses the challenge of ensuring reliable vias in glass substrates of integrated circuit packages, enhancing the overall performance and longevity of electronic devices.

Benefits: Improved reliability and performance of vias in glass substrate-based integrated circuit packages, leading to enhanced durability and functionality of electronic devices.

Commercial Applications: The technology can be leveraged by manufacturers of electronic components, telecommunications equipment, and automotive systems to enhance the quality and reliability of their products, potentially gaining a competitive edge in the market.

Questions about the technology: 1. How does the use of gallium and silver in the conductive material improve the reliability of vias in glass substrates? 2. What are the potential cost implications of implementing this technology in the production of integrated circuit packages?

Original Abstract Submitted

methods, systems, apparatus, and articles of manufacture to improve reliability of vias in a glass substrate of an integrated circuit package are disclosed. an example integrated circuit (ic) package substrate includes a glass substrate, a via extending between first and second surfaces of the glass substrate, and a conductive material provided in the via, the conductive material including gallium and silver.