Intel corporation (20240274521). METHODS AND APPARATUS TO REDUCE IMPEDANCE DISCONTINUITIES AND CROSSTALK IN INTEGRATED CIRCUIT PACKAGES simplified abstract
METHODS AND APPARATUS TO REDUCE IMPEDANCE DISCONTINUITIES AND CROSSTALK IN INTEGRATED CIRCUIT PACKAGES
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METHODS AND APPARATUS TO REDUCE IMPEDANCE DISCONTINUITIES AND CROSSTALK IN INTEGRATED CIRCUIT PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240274521 titled 'METHODS AND APPARATUS TO REDUCE IMPEDANCE DISCONTINUITIES AND CROSSTALK IN INTEGRATED CIRCUIT PACKAGES
Simplified Explanation: The patent application describes methods, apparatus, systems, and articles of manufacture to reduce impedance discontinuities and crosstalk in integrated circuit packages. It specifically focuses on an apparatus that includes a package substrate with a ball grid array and a metal interconnect to improve electrical coupling.
- The apparatus includes a package substrate with a ball grid array on one surface.
- The ball grid array enables electrical coupling to a circuit board.
- A metal interconnect within the package substrate is electrically coupled to the ball grid array.
- The metal interconnect features an inductive loop that extends towards adjacent balls in the array.
Key Features and Innovation:
- Integration of a ball grid array and metal interconnect within a package substrate.
- Use of an inductive loop in the metal interconnect to reduce impedance discontinuities.
- Focus on reducing crosstalk in integrated circuit packages.
Potential Applications:
- Semiconductor manufacturing
- Electronics industry
- Integrated circuit design
Problems Solved:
- Impedance discontinuities in integrated circuit packages
- Crosstalk issues in electronic systems
Benefits:
- Improved signal integrity
- Enhanced electrical coupling
- Reduced interference
Commercial Applications: Potential commercial applications include:
- High-speed data transmission systems
- Telecommunications equipment
- Consumer electronics devices
Prior Art: Prior art related to this technology may include:
- Studies on impedance matching in integrated circuits
- Research on crosstalk reduction techniques
Frequently Updated Research: Stay updated on the latest advancements in:
- Integrated circuit packaging
- Signal integrity optimization
Questions about Integrated Circuit Packages: 1. How does the inductive loop in the metal interconnect help reduce crosstalk? 2. What are the main challenges in implementing impedance matching in integrated circuit packages?
Original Abstract Submitted
methods, apparatus, systems, and articles of manufacture to reduce impedance discontinuities and crosstalk in integrated circuit packages are disclosed. a disclosed apparatus includes: a package substrate, and a ball grid array on a first surface of the package substrate. the ball grid array includes a first ball and a second ball adjacent the first ball. the ball grid array is to enable the package substrate to be electrically coupled to a circuit board. the apparatus further includes a metal interconnect within the package substrate. the metal interconnect is electrically coupled to the first ball. the metal interconnect includes an inductive loop that extends toward the second ball.
