Intel corporation (20240258183). PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL simplified abstract

PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL

Organization Name

intel corporation

Inventor(s)

Edvin Cetegen of Chandler AZ (US)

Jacob Vehonsky of Gilbert AZ (US)

Nicholas S. Haehn of Scottsdale AZ (US)

Thomas Heaton of Mesa AZ (US)

Steve S. Cho of Chandler AZ (US)

Rahul Jain of Gilbert AZ (US)

Tarek Ibrahim of Mesa AZ (US)

Antariksh Rao Pratap Singh of Gilbert AZ (US)

Nicholas Neal of Scottsdale AZ (US)

Sergio Chan Arguedas of Chandler AZ (US)

Vipul Mehta of Chandler AZ (US)

PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240258183 titled 'PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL

Simplified Explanation

The patent application describes electronic packages with underfill flow control features. These packages include a package substrate, interconnects, a die, and a flow control feature that helps regulate the flow of underfill material.

• The electronic package consists of a package substrate and interconnects.
• A die is connected to the package substrate through the interconnects.
• A flow control feature is located near the package substrate.
• The flow control feature is isolated from the electronic package's circuitry.
• The electronic package also contains underfill material that surrounds the interconnects and contacts the flow control feature.

Key Features and Innovation

• Electronic packages with underfill flow control features.
• Flow control feature regulates the flow of underfill material.
• Isolated flow control feature from the electronic package's circuitry.

Potential Applications

This technology can be applied in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics. It can also be used in industrial applications where precise control of underfill material flow is required.

Problems Solved

• Regulating the flow of underfill material in electronic packages.
• Preventing interference between the flow control feature and the electronic package's circuitry.

Benefits

• Improved reliability and performance of electronic packages.
• Enhanced control over underfill material flow.
• Reduced risk of damage to electronic components.

Commercial Applications

• The technology can be utilized in the manufacturing of electronic devices to improve their durability and longevity. It can also be integrated into industrial equipment to ensure precise underfill material application.

Questions about Electronic Packages with Underfill Flow Control Features

How does the flow control feature in electronic packages work?

The flow control feature in electronic packages helps regulate the flow of underfill material, ensuring proper distribution and preventing damage to electronic components.

What are the potential benefits of using underfill flow control features in electronic packages?

The use of underfill flow control features can lead to improved reliability, performance, and longevity of electronic devices by ensuring precise control over the underfill material flow.

Original Abstract Submitted

embodiments disclosed herein include electronic packages with underfill flow control features. in an embodiment, an electronic package comprises a package substrate and a plurality of interconnects on the package substrate. in an embodiment, a die is coupled to the package substrate by the plurality of interconnects and a flow control feature is adjacent on the package substrate. in an embodiment, the flow control feature is electrically isolated from circuitry of the electronic package. in an embodiment, the electronic package further comprises an underfill surrounding the plurality of interconnects and in contact with the flow control feature.