Google llc (20240347414). Methods And Heat Distribution Devices For Thermal Management Of Chip Assemblies simplified abstract

Methods And Heat Distribution Devices For Thermal Management Of Chip Assemblies

Organization Name

google llc

Inventor(s)

Madhusudan K. Iyengar of Foster City CA (US)

Christopher Malone of Mountain View CA (US)

Woon-Seong Kwon of Santa Clara CA (US)

Emad Samadiani of Cupertino CA (US)

Melanie Beauchemin of Mountain View CA (US)

Padam Jain of San Jose CA (US)

Teckgyu Kang of Saratoga CA (US)

Yuan Li of Sunnyvale CA (US)

Connor Burgess of Alameda CA (US)

Norman Paul Jouppi of Palo Alto CA (US)

Nicholas Stevens-yu of Palo Alto CA (US)

Yingying Wang of Sunnyvale CA (US)

Methods And Heat Distribution Devices For Thermal Management Of Chip Assemblies - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240347414 titled 'Methods And Heat Distribution Devices For Thermal Management Of Chip Assemblies

The method of manufacturing a chip assembly involves joining an in-process unit to a printed circuit board, reflowing a bonding material to electrically connect the unit with the board, and then attaching a heat distribution device to the semiconductor chips using a thermal interface material with a lower reflow temperature.

• Joining an in-process unit to a printed circuit board
• Reflowing a bonding material to connect the unit with the board
• Attaching a heat distribution device to the semiconductor chips using a thermal interface material
• In-process unit includes a substrate, interposer, semiconductor chips, and stiffener
• Thermal interface material has a lower reflow temperature than the bonding material

Potential Applications: - Electronics manufacturing - Semiconductor industry - Chip assembly processes

Problems Solved: - Efficient thermal management in chip assemblies - Reliable electrical connections between components - Simplified manufacturing processes

Benefits: - Improved heat dissipation - Enhanced reliability of electronic devices - Streamlined chip assembly procedures

Commercial Applications: Title: Advanced Chip Assembly Technology for Enhanced Thermal Management This technology can be used in the production of various electronic devices such as smartphones, computers, and automotive electronics to improve performance and reliability.

Questions about Chip Assembly Technology: 1. How does the use of a thermal interface material improve heat dissipation in chip assemblies? 2. What are the advantages of joining an in-process unit to a printed circuit board during manufacturing?

Original Abstract Submitted

a method of manufacturing a chip assembly comprises joining an in-process unit to a printed circuit board; reflowing a bonding material disposed between and electrically connecting the in-process unit with the printed circuit board, the bonding material having a first reflow temperature; and then joining a heat distribution device to the plurality of semiconductor chips using a thermal interface material (“tim”) having a second reflow temperature that is lower than the first reflow temperature. the in-process unit further comprises a substrate having an active surface, a passive surface, and contacts exposed at the active surface; an interposer electrically connected to the substrate; a plurality of semiconductor chips overlying the substrate and electrically connected to the substrate through the interposer, and a stiffener overlying the substrate and having an aperture extending therethrough, the plurality of semiconductor chips being positioned within the aperture.