Gm global technology operations llc (20240234238). POWER MODULE THERMAL MANAGEMENT simplified abstract
Contents
POWER MODULE THERMAL MANAGEMENT
Organization Name
gm global technology operations llc
Inventor(s)
Chandra S. Namuduri of Troy MI (US)
POWER MODULE THERMAL MANAGEMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240234238 titled 'POWER MODULE THERMAL MANAGEMENT
The patent application discusses a power module with enhanced thermal management, including a direct bond copper (DBC) substrate and a thin-film thermoelectric cooler (TFTEC) to regulate temperature.
- Direct bond copper (DBC) substrate with top and bottom copper layers separated by a dielectric layer.
- Thin-film thermoelectric cooler (TFTEC) with a thermoelectric film between top and bottom insulators.
- Controller adjusts the thermoelectric device current of the TFTEC based on the temperature of the dies.
Potential Applications: - Power electronics - Automotive industry - Renewable energy systems
Problems Solved: - Improved thermal management in power modules - Enhanced efficiency and reliability of electronic devices
Benefits: - Better heat dissipation - Increased performance and longevity of electronic components
Commercial Applications: Title: "Advanced Thermal Management Solutions for Power Modules" This technology can be utilized in various industries such as automotive, telecommunications, and renewable energy for more efficient and reliable power systems.
Prior Art: Readers can explore prior patents related to thermal management in power modules, thermoelectric coolers, and direct bond copper substrates.
Frequently Updated Research: Stay updated on advancements in thermoelectric materials, power module design, and thermal management techniques for electronic devices.
Questions about the Technology: 1. How does the thin-film thermoelectric cooler (TFTEC) improve thermal management in power modules? 2. What are the potential long-term benefits of using a direct bond copper (DBC) substrate in electronic devices?
Original Abstract Submitted
aspects of the disclosure include a power module having enhanced thermal management. an exemplary power module can include a direct bond copper (dbc) substrate having a top copper layer, a bottom copper layer, and a dielectric layer between the top copper layer and the bottom copper layer. the power module includes a thin-film thermoelectric cooler (tftec) having a thermoelectric film positioned between a top insulator and a bottom insulator. one or more dies are positioned over the dbc substrate and the tftec and a controller is configured to adjust a thermoelectric device current of the tftec responsive to a temperature of the one or more dies.
