Dell products l.p. (20240341040). PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND ASSEMBLED BOARDS MADE USING THE SAME simplified abstract
Contents
- 1 PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND ASSEMBLED BOARDS MADE USING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND ASSEMBLED BOARDS MADE USING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Questions about Board Assembly Processes
- 1.11 Original Abstract Submitted
PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND ASSEMBLED BOARDS MADE USING THE SAME
Organization Name
Inventor(s)
Subramanian Vasudevan of Cedar Park TX (US)
Edward Rhem of Leander TX (US)
Philip Conde of Austin TX (US)
Wallace Ables of Georgetown TX (US)
Edwin C. Tinsley of Austin TX (US)
PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND ASSEMBLED BOARDS MADE USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240341040 titled 'PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND ASSEMBLED BOARDS MADE USING THE SAME
Simplified Explanation
The patent application discloses board assembly processes using multiple electrically conductive solder types to attach different electronic components to a printed circuit board (PCB).
Key Features and Innovation
- Multiple electronic components can be attached to a common PCB using a multiple-step assembly process.
- The assembly process may involve different solder reflow temperatures and multiple solder types with varying melting points.
- Various forms of solder, such as solder paste, wire solder, and ingot solder, can be used.
Potential Applications
The technology can be applied in the electronics manufacturing industry for assembling complex electronic devices with different components.
Problems Solved
The technology addresses the challenge of attaching various electronic components with different melting points to a single PCB efficiently.
Benefits
- Increased flexibility in board assembly processes.
- Enhanced reliability in attaching diverse electronic components.
- Improved efficiency in manufacturing complex electronic devices.
Commercial Applications
- Electronics manufacturing for consumer electronics.
- Industrial automation for control systems.
- Telecommunications for networking equipment.
Questions about Board Assembly Processes
How does the use of multiple solder types benefit the board assembly process?
The use of multiple solder types allows for attaching electronic components with different melting points efficiently, increasing flexibility in the assembly process.
What are the potential challenges in implementing a multiple-step assembly process with different solder types?
One potential challenge could be ensuring compatibility between the various solder types and managing the different reflow temperatures effectively.
Original Abstract Submitted
board assembly processes are disclosed that may be implemented using multiple different electrically conductive solder types to assemble or attach different electronic components to a printed circuit board (pcb). for example, multiple different electronic components may be attached to a common pcb using a multiple-step assembly process that may be performed at different solder reflow temperatures and/or which may incorporate multiple different solder types having different respective minimum reflow temperatures (i.e., melting point temperatures). the disclosed processes may be implementing using a variety of different forms of solder, such as solder paste form, wire solder form, ingot solder form, etc.
