Dell products l.p. (20240340565). SPEAKER MODULE FOR AN INFORMATION HANDLING SYSTEM simplified abstract
Contents
SPEAKER MODULE FOR AN INFORMATION HANDLING SYSTEM
Organization Name
Inventor(s)
CHIA-HUNG Shih of Taipei City (TW)
CHIN-CHUNG Wu of New Taipei City (TW)
CHIEN-YU Huang of New Taipei City (TW)
CHUN-KAI Tzeng of Keelung City (TW)
SPEAKER MODULE FOR AN INFORMATION HANDLING SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240340565 titled 'SPEAKER MODULE FOR AN INFORMATION HANDLING SYSTEM
The speaker module described in the patent application includes a speaker enclosure with a recessed portion and a transducer with a rubber cap surrounding it. The transducer is positioned within the recessed portion of the speaker enclosure, with the rubber cap acting as a protective barrier between the transducer and the speaker.
- The speaker module features a transducer with a rubber cap that surrounds it, providing protection and support.
- The rubber cap has edges that define an inside perimeter and include a slot for the transducer to fit into securely.
- The transducer is coupled to the speaker enclosure in a way that positions it within the recessed portion, ensuring proper alignment and functionality.
Potential Applications: - This technology can be used in various audio devices such as speakers, headphones, and sound systems. - It can also be applied in automotive audio systems, home entertainment systems, and public address systems.
Problems Solved: - Protects the transducer from damage or external elements that could affect its performance. - Ensures proper alignment and positioning of the transducer within the speaker enclosure.
Benefits: - Enhanced durability and longevity of the speaker module. - Improved sound quality and performance due to secure transducer positioning.
Commercial Applications: - This technology can be utilized by audio equipment manufacturers to enhance the quality and reliability of their products, potentially increasing customer satisfaction and brand reputation.
Questions about the speaker module: 1. How does the rubber cap contribute to the overall performance of the speaker module? 2. What are the potential cost implications of implementing this technology in audio devices?
Original Abstract Submitted
a speaker module, including: a speaker enclosure, including: a recessed portion; a transducer, including: a top surface; a bottom surface; a perimeter surface positioned between the top surface and the bottom surface; a rubber cap including: a top side; a bottom side; and edges extending between the top side and the bottom side, wherein the edges define an inside perimeter of the rubber cap and include a slot extending along the inside perimeter of the rubber cap, wherein, the transducer is coupled to the rubber cap such that the rubber cap surrounds the transducer and the perimeter surface of the transducer is positioned within the slot of the plurality of edges of the rubber cap, wherein, the transducer is coupled to the speaker enclosure such that the transducer is positioned within the recessed portion of the speaker enclosure and the rubber cap is positioned between the transducer and the speaker.
