Category:Yong LIU of Cumberland Foreside ME (US)

Yong LIU of Cumberland Foreside ME (US)

Executive Summary

Yong LIU of Cumberland Foreside ME (US) is an inventor who has filed 4 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), Cooling facilitated by shape of device {( (2 patents), and they have worked with companies such as SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (4 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L23/3735 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L23/3675 (Cooling facilitated by shape of device {(): 2 patents
• H01L21/565 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H05K7/2089 (Modifications to facilitate cooling, ventilating, or heating): 2 patents
• H01L2224/32245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/84801 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2924/13055 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/33 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/3107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/52 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49575 (Lead-frames {or other flat leads (): 1 patents
• H01L23/49524 (Lead-frames {or other flat leads (): 1 patents
• H01L23/49551 (Lead-frames {or other flat leads (): 1 patents
• H01L23/49562 (Lead-frames {or other flat leads (): 1 patents
• H01L2224/40245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/4871 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L24/83 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/83815 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32237 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L23/367 (Cooling facilitated by shape of device {(): 1 patents
• H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/30 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

List of Companies

• SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC: 4 patents

Collaborators

• Liangbiao CHEN of Scarborough ME (US) (2 collaborations)
• Tzu-Hsuan CHENG of Scarborough ME (US) (2 collaborations)
• Stephen ST. GERMAIN of Gilbert AZ (US) (1 collaborations)
• Roger ARBUTHNOT of Mesa AZ (US) (1 collaborations)
• Leo GU (1 collaborations)
• Sixin JI (1 collaborations)
• Jie CHANG (1 collaborations)
• Keunhyuk LEE (1 collaborations)
• Yusheng LIN of Phoenix AZ (US) (1 collaborations)
• Jerome TEYSSEYRE of Scottsdale AZ (US) (1 collaborations)