Category:Thomas H. Kinsley of Boise ID (US)

Thomas H. Kinsley of Boise ID (US)

Executive Summary

Thomas H. Kinsley of Boise ID (US) is an inventor who has filed 4 patents. Their primary areas of innovation include Power supply or voltage generation circuits, e.g. bias voltage generators, substrate voltage generators, back-up power, power control circuits (1 patents), ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models (1 patents), Power supply means, e.g. regulation thereof (for memories (1 patents), and they have worked with companies such as Lodestar Licensing Group LLC (4 patents). Their most frequent collaborators include (2 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• G11C11/4074 (Power supply or voltage generation circuits, e.g. bias voltage generators, substrate voltage generators, back-up power, power control circuits): 1 patents
• G06F13/102 (ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models): 1 patents
• G06F1/26 (Power supply means, e.g. regulation thereof (for memories): 1 patents
• H02M3/156 (APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers): 1 patents
• H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• G11C5/04 (Supports for storage elements {, e.g. memory modules}; Mounting or fixing of storage elements on such supports): 1 patents
• H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 1 patents
• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L23/5385 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L24/02 ({Bonding areas (on insulating substrates, e.g. chip carriers,): 1 patents
• H01L24/06 ({of a plurality of bonding areas}): 1 patents
• H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/49 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H05K1/0243 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H01L23/49894 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/023 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0237 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0401 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/04042 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/061 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/131 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/45099 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/4912 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73207 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73251 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/85411 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/85439 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/85447 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/85455 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/8559 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/856 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/0651 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06527 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06565 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1436 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/15183 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/15311 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H05K1/181 (Printed circuits structurally associated with non-printed electric components ({): 1 patents
• H05K2201/10159 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/10522 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• G11C11/40611 (STATIC STORES (semiconductor memory devices): 1 patents
• G11C7/1072 ({for memories with random access ports synchronised on clock signal pulse trains, e.g. synchronous memories, self timed memories}): 1 patents
• G11C11/407 (STATIC STORES (semiconductor memory devices): 1 patents
• G06F13/4234 (Bus transfer protocol, e.g. handshake; Synchronisation): 1 patents
• G06F11/1068 ({in sector programmable memories, e.g. flash disk (): 1 patents
• G11C7/10 (Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers): 1 patents

Companies

List of Companies

• Lodestar Licensing Group LLC: 4 patents

Collaborators

• Matthew A. Prather of Boise ID (US) (2 collaborations)
• George E. Pax of Boise ID (US) (1 collaborations)
• George E. Pax of Lake City FL (US) (1 collaborations)
• Timothy M. Hollis of Meridian ID (US) (1 collaborations)
• Yogesh Sharma of Boise ID (US) (1 collaborations)
• Randon K. Richards of Kuna ID (US) (1 collaborations)
• Chan H. Yoo of Boise ID (US) (1 collaborations)
• Gregory A. King of Hastings MN (US) (1 collaborations)
• Eric J. Stave of Meridian ID (US) (1 collaborations)