Category:Takeshi KAMIKAWA

Takeshi KAMIKAWA

Executive Summary

Takeshi KAMIKAWA is an inventor who has filed 11 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (7 patents), SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds, (5 patents), SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds, (5 patents), and they have worked with companies such as KYOCERA Corporation (9 patents), KYOCERA CORPORATION (2 patents). Their most frequent collaborators include (6 collaborations), (6 collaborations), (5 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L21/0254 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
• C30B25/04 (SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds,): 5 patents
• C30B29/406 (SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds,): 5 patents
• H01L29/2003 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L21/02647 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• C30B25/183 (SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds,): 3 patents
• H01L33/20 (with a particular shape, e.g. curved or truncated substrate): 3 patents
• H01L21/02609 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L21/0265 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L29/0642 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L29/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• C23C14/042 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 2 patents
• C23C14/0617 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 2 patents
• C23C14/34 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 2 patents
• C30B25/186 (SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds,): 2 patents
• H01L21/02645 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L33/62 (Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls): 2 patents
• H01S5/02315 (Support members, e.g. bases or carriers): 2 patents
• H01L2933/0066 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L33/007 ({comprising nitride compounds}): 2 patents
• H01L21/02639 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L25/0753 (the devices being of a type provided for in group): 2 patents
• H01L33/32 (containing nitrogen): 2 patents
• H01S5/04257 (Processes or apparatus for excitation, e.g. pumping, {e.g. by electron beams} (): 1 patents
• H01S5/2205 (DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL): 1 patents
• H01S5/34333 (in A): 1 patents
• H01L21/0262 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/304 (Mechanical treatment, e.g. grinding, polishing, cutting {(): 1 patents
• H01L21/76871 ({Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers}): 1 patents
• H01L21/02381 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L33/16 (with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous): 1 patents
• H01S5/021 (DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL): 1 patents
• H01L33/0093 ({Wafer bonding; Removal of the growth substrate}): 1 patents
• H01L33/12 (with a stress relaxation structure, e.g. buffer layer): 1 patents
• H01S5/0201 (DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL): 1 patents
• H01S5/0206 (DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL): 1 patents
• C30B29/38 (Nitrides): 1 patents
• H01L21/0237 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

List of Companies

• KYOCERA Corporation: 9 patents
• KYOCERA CORPORATION: 2 patents

Collaborators

• Yuta AOKI (6 collaborations)
• Katsuaki MASAKI (6 collaborations)
• Toshihiro KOBAYASHI (5 collaborations)
• Yuichiro HAYASHI (5 collaborations)
• Yoshinobu KAWAGUCHI (3 collaborations)
• Kentaro MURAKAWA (3 collaborations)
• Kazuma TAKEUCHI (2 collaborations)
• Fumio YAMASHITA (2 collaborations)
• Yuki TANIGUCHI (1 collaborations)