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Category:Si-Woo Lee of Boise ID (US)
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Pages in category "Si-Woo Lee of Boise ID (US)"
The following 12 pages are in this category, out of 12 total.
1
- 17815359. METHODS OF FORMING THE MICROELECTRONIC DEVICES, AND RELATED MICROELECTONIC DEVICES AND ELECTRONIC SYSTEMS simplified abstract (Micron Technology, Inc.)
- 17886917. RECESSED CHANNEL FIN INTEGRATION simplified abstract (Micron Technology, Inc.)
- 17888460. MULTIPLE, ALTERNATING EPITAXIAL SILICON FOR HORIZONTAL ACCESS DEVICES IN VERTICAL THREE DIMENSIONAL (3D) MEMORY simplified abstract (Micron Technology, Inc.)
- 17888467. SUPPORT STRUCTURE FOR MULTIPLE, ALTERNATING EPITAXIAL SILICON simplified abstract (Micron Technology, Inc.)
- 17895017. FABRICATION METHOD OF A LATERAL 3D MEMORY DEVICE simplified abstract (Micron Technology, Inc.)
- 17945448. SUPPORT PILLARS WITH MULTIPLE, ALTERNATING EPITAXIAL SILICON FOR HORIZONTAL ACCESS DEVICES IN VERTICAL simplified abstract (Micron Technology, Inc.)
- 17946925. VERTICAL DIGIT LINES WITH ALTERNATING EPITAXIAL SILICON FOR HORIZONTAL ACCESS DEVICES IN 3D MEMORY simplified abstract (Micron Technology, Inc.)
- 18054316. MICROELECTRONIC DEVICES, AND RELATED METHODS OF FORMING MICROELECTRONIC DEVICES simplified abstract (Micron Technology, Inc.)
- 18237206. TRANSISTORS WITH MITIGATED FREE BODY EFFECT simplified abstract (Micron Technology, Inc.)
- 18387641. BOTTOM ELECTRODE CONTACT FOR A VERTICAL THREE-DIMENSIONAL MEMORY simplified abstract (Micron Technology, Inc.)