Category:Seungwon IM

Seungwon IM

Executive Summary

Seungwon IM is an inventor who has filed 15 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (5 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), by flowing liquids {( (3 patents), and they have worked with companies such as SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (15 patents). Their most frequent collaborators include (12 collaborations), (4 collaborations), (4 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L21/56 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L23/473 (by flowing liquids {(): 3 patents
• H01L23/49861 ({Lead-frames fixed on or encapsulated in insulating substrates (): 3 patents
• H01L23/3121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/3107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/3672 ({Foil-like cooling fins or heat sinks (being part of lead-frames): 3 patents
• H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 3 patents
• H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L2224/48225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/49811 ({Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads (): 3 patents
• H01L23/433 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/49568 (Lead-frames {or other flat leads (): 2 patents
• H05K1/18 (Printed circuits structurally associated with non-printed electric components ({): 2 patents
• H05K1/11 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents
• H05K2201/10166 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents
• H01L23/49555 (Lead-frames {or other flat leads (): 2 patents
• H01L2224/32245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L25/0652 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 2 patents
• H01L21/4853 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 2 patents
• H01L23/49833 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 2 patents
• H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/48175 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2924/13055 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/4334 ({Auxiliary members in encapsulations (): 1 patents
• H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/24 (solid or gel at the normal operating temperature of the device {(): 1 patents
• H01L2224/33 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/367 (Cooling facilitated by shape of device {(): 1 patents
• H01L23/373 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/4846 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L21/4882 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L23/3735 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/42 (Fillings or auxiliary members in containers {or encapsulations} selected or arranged to facilitate heating or cooling): 1 patents
• H01L23/49503 (Lead-frames {or other flat leads (): 1 patents
• H01L25/071 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups): 1 patents
• H01L23/49562 (Lead-frames {or other flat leads (): 1 patents
• H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L24/40 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/40225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73221 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/486 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L21/565 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48011 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48095 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/13091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1815 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/182 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/183 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/186 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/15 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/4825 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L21/4839 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L23/49844 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L25/162 (the devices being of types provided for in two or more different main groups of groups): 1 patents
• H01L2224/48139 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73265 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/12036 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01R12/585 (terminals for insertion into holes): 1 patents

Companies

List of Companies

• SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC: 15 patents

Collaborators

• Oseob JEON (12 collaborations)
• Dongwook KANG (4 collaborations)
• Jihwan KIM (4 collaborations)
• Byoungok LEE (3 collaborations)
• Rajani Kumar THIRUKOLURI (3 collaborations)
• Roveendra PAUL of Dublin CA (US) (3 collaborations)
• Yoonsoo LEE (2 collaborations)
• Dukyong LEE (2 collaborations)
• Jeonghyuk PARK (2 collaborations)
• Keunhyuk LEE (2 collaborations)
• Jerome TEYSSEYRE (2 collaborations)
• Joonseo SON (1 collaborations)
• Changyoung PARK (1 collaborations)
• Paolo BILARDO (1 collaborations)
• Jooyang EOM (1 collaborations)
• Inpil YOO (1 collaborations)
• Jeungdae KIM (1 collaborations)
• Heejo CHI (1 collaborations)
• Jonghwan BAEK (1 collaborations)
• Chee Hiong CHEW (1 collaborations)